Cheyun Lin

According to our database, Cheyun Lin authored at least 4 papers between 2020 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced process nodes.

Rahim Kasim, Cheyun Lin, Christopher Perini, James Palmer, N. Gilda, S. Imam, Justin R. Weber, C. Wallace, Jeffery Hicks

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2021

Intrinsic Reliability of BEOL interlayer dielectric.

James Palmer, Galor Zhang, Justin R. Weber, Cheyun Lin, Christopher Perini, Rahim Kasim

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020

Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking.

Chetan Prasad, Sunny Chugh, Hannes Greve, I-chen Ho, Enamul Kabir, Cheyun Lin, Mahjabin Maksud, Steven R. Novak, Benjamin Orr, Keun Woo Park, Anthony Schmitz, Zhizheng Zhang, Peng Bai, Doug B. Ingerly, Emre Armagan, Hsinwei Wu, Patrick N. Stover, Lance Hibbeler, Michael O'Day, Daniel Pantuso

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel's 10+ Process.

Cheyun Lin, Uygar E. Avci, M. A. Blount, Rohit Grover, Jeffery Hicks, R. Kasim, A. Kundu, C. M. Pelto, C. Ryder, Anthony Schmitz, K. Sethi, D. Seghete, D. J. Towner, A. J. Welsh, J. Weber, C. Auth

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020