Anthony Schmitz

According to our database, Anthony Schmitz authored at least 4 papers between 2018 and 2020.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2020

Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking.

Chetan Prasad, Sunny Chugh, Hannes Greve, I-chen Ho, Enamul Kabir, Cheyun Lin, Mahjabin Maksud, Steven R. Novak, Benjamin Orr, Keun Woo Park, Anthony Schmitz, Zhizheng Zhang, Peng Bai, Doug B. Ingerly, Emre Armagan, Hsinwei Wu, Patrick N. Stover, Lance Hibbeler, Michael O'Day, Daniel Pantuso

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel's 10+ Process.

Cheyun Lin, Uygar E. Avci, M. A. Blount, Rohit Grover, Jeffery Hicks, R. Kasim, A. Kundu, C. M. Pelto, C. Ryder, Anthony Schmitz, K. Sethi, D. Seghete, D. J. Towner, A. J. Welsh, J. Weber, C. Auth

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

A Reliability Overview of Intel's 10+ Logic Technology.

Rohit Grover, Tony Acosta, C. AnDyke, Emre Armagan, C. Auth, Sunny Chugh, K. Downes, M. Hattendorf, N. Jack, S. Joshi, R. Kasim, Gerald S. Leatherman, S.-H. Lee, C.-Y. Lin, A. Madhavan, H. Mao, A. Lowrie, G. Martin, G. McPherson, Pinakpani Nayak, A. Neale, D. Nminibapiel, Benjamin Orr, James Palmer, C. M. Pelto, S. S. Poon, I. Post, Tanmoy Pramanik, Anisur Rahman, Stephen Ramey, N. Seifert, K. Sethi, Anthony Schmitz, H. Wu, A. Yeoh

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2018

Reliability of dual-damascene local interconnects featuring cobalt on 10 nm logic technology.

F. Griggio, James Palmer, F. Pan, N. Toledo, Anthony Schmitz, Ilan Tsameret, R. Kasim, Gerald S. Leatherman, Jeffery Hicks, A. Madhavan, J. Shin, J. Steigerwald, A. Yeoh, C. Auth

Proceedings of the IEEE International Reliability Physics Symposium, 2018