Patrick N. Stover

According to our database, Patrick N. Stover authored at least 3 papers between 2020 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

Ponte Vecchio: A Multi-Tile 3D Stacked Processor for Exascale Computing.

Wilfred Gomes, Altug Koker, Patrick N. Stover, Doug B. Ingerly, Scott Siers, Srikrishnan Venkataraman, Chris Pelto, Tejas Shah, Amreesh Rao, Frank O'Mahony, Eric Karl, Lance Cheney, Iqbal Rajwani, Hemant Jain, Ryan Cortez, Arun Chandrasekhar, Basavaraj Kanthi, Raja Koduri

Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2020

8.1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12×12mm², 1mm Package-on-Package.

Wilfred Gomes, Sanjeev Khushu, Doug B. Ingerly, Patrick N. Stover, Nasirul I. Chowdhury, Frank O'Mahony, Ajay Balankutty, Noam Dolev, Martin G. Dixon, Lei Jiang, Surya Prekke, Biswajit Patra, Pavel V. Rott, Rajesh Kumar

Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking.

Chetan Prasad, Sunny Chugh, Hannes Greve, I-chen Ho, Enamul Kabir, Cheyun Lin, Mahjabin Maksud, Steven R. Novak, Benjamin Orr, Keun Woo Park, Anthony Schmitz, Zhizheng Zhang, Peng Bai, Doug B. Ingerly, Emre Armagan, Hsinwei Wu, Patrick N. Stover, Lance Hibbeler, Michael O'Day, Daniel Pantuso

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020