Jeffery Hicks

According to our database, Jeffery Hicks authored at least 8 papers between 2015 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

E-Core Implementation in Intel 4 with PowerVia (Backside Power) Technology.

M. Shamanna, E. Abuayob, G. Aenuganti, C. Alvares, J. Antony, A. Bahudhanam, A. Chandran, P. Chew, A. Chatterjee, B. Chauhan, N. Dandeti, J. Desai, M. Doyle, T. Dmukauskas, P. Farache, E. Fetzer, K. Fischer, P. Hack, Y. Greenzweig, J. Giacobbe, Walid M. Hafez, E. Haralson, A. Hegde, A. Illa, M. Islam, S. Jain, M. Jang, J. Nguyen, T. Tong, L. Jiang, Eric Karl, P. Kalangi, G. Khoo, A. Krishnamoorthy, B. Kuns, W. Li, R. Livengood, T. Malik, R. Priyanka, H. Faraby, Y. Maymon, K. Mistry, K. Morgan, S. Natarajan, O. Nevo, M. Oh, P. Pardy, J. Park, P. Penmatsa, B. Phelps, C. Peterson, S. Rajappa, A. Raveh, A Rezaie, T. Ravishankar, R. Ramaswamy, S. Reddy, R. Saha, S. Sen, R. Sanchez, R. Sanaga, B. Simkhovich, Bernhard Sell, M. Senger, B. Schnarch, M. Seshadri, O. Sidorov, S. Subramanian, K. Subramanian, B. Truong, S. Bangalore, Jeffery Hicks, S. Venkatesh, D. Christensen, K. Bhargav, M. Von Haartman, P. Joshi, S. Zickel, C.-H. Lin, J. Huening, T.-H. Wu, N. Bakken, A. Afzal, A. Raman, Sj. Rao, V. Kawar, J. Neirynck, D. Bradley, M. Duwe, S. Wu, V. Patil, M. Bayoumy

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Novel Cell Architectures with Back-side Transistor Contacts for Scaling and Performance.

Mauro J. Kobrinsky, J. D. Silva, E. Mannebach, S. Mills, M. Abd El Qader, O. Adebayo, N. Arkali Radhakrishna, M. Beasley, J. Chawla, S. Chugh, A. Dasgupta, U. Desai, E. De Re, G. Dewey, T. Edwards, C. Engel, V. Gudmundsson, Jeffery Hicks, B. Krist, R. Mehandru, Inanc Meric, Patrick Morrow, D. Nandi, P. Patel, R. Ramamurthy, D. Samanta, L. Shoer, A. St Amour, L. H. Tan, Sukru Yemenicioglu, X. Wang, T. Ghani

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing.

Walid M. Hafez, P. Agnihotri, M. Asoro, M. Aykol, B. Bains, R. Bambery, M. Bapna, A. Barik, A. Chatterjee, P. C. Chiu, T. Chu, C. Firby, K. Fischer, M. Fradkin, Hannes Greve, A. Gupta, E. Haralson, M. Haran, Jeffery Hicks, A. Illa, M. Jang, S. Klopcic, M. Kobrinsky, B. Kuns, H.-h. Lai, G. Lanni, S.-H. Lee, N. Lindert, C.-l. Lo, Y. Luo, G. Malyavanatham, B. Marinkovic, Y. Maymon, M. Nabors, J. Neirynck, P. Packan, A. Paliwal, L. Pantisano, Leif Paulson, Padma Penmatsa, Chetan Prasad, Conor Puls, T. Rahman, R. Ramaswamy, S. Samant, Bernhard Sell, K. Sethi, F. Shah, M. Shamanna, K. Shang, Q. Li, M. Sibakoti, J. Stoeger, N. Strutt, R. Thirugnanasambandam, C. Tsai, X. Wang, A. Wang, S.-j. Wu, Q. Xu, X.-h. Zhong, S. Natarajan

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced process nodes.

Rahim Kasim, Cheyun Lin, Christopher Perini, James Palmer, N. Gilda, S. Imam, Justin R. Weber, C. Wallace, Jeffery Hicks

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2020

Novel Re-configurable Circuits For Aging Characterization: Connecting Devices to Circuits.

Ketul B. Sutaria, Jihan Standfest, Inanc Meric, Amirhossein H. Davoody, Swaroop Kumar Namalapuri, Trinadh Mutyala, Supriya P., Balkaran Gill, Stephen Ramey, Jeffery Hicks

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel's 10+ Process.

Cheyun Lin, Uygar E. Avci, M. A. Blount, Rohit Grover, Jeffery Hicks, R. Kasim, A. Kundu, C. M. Pelto, C. Ryder, Anthony Schmitz, K. Sethi, D. Seghete, D. J. Towner, A. J. Welsh, J. Weber, C. Auth

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2018

Reliability of dual-damascene local interconnects featuring cobalt on 10 nm logic technology.

F. Griggio, James Palmer, F. Pan, N. Toledo, Anthony Schmitz, Ilan Tsameret, R. Kasim, Gerald S. Leatherman, Jeffery Hicks, A. Madhavan, J. Shin, J. Steigerwald, A. Yeoh, C. Auth

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015

Transistor reliability variation correlation to threshold voltage.

Stephen Ramey, M. Chahal, P. Nayak, Steven R. Novak, Chetan Prasad, Jeffery Hicks

Proceedings of the IEEE International Reliability Physics Symposium, 2015