Daehyun Chung

According to our database, Daehyun Chung authored at least 3 papers between 2006 and 2009.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2009

Electrical-thermal co-analysis for power delivery networks in 3D system integration.

Jianyong Xie, Daehyun Chung, Madhavan Swaminathan, Michael McAllister, Alina Deutsch, Lijun Jiang, Barry J. Rubin

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Electrical modeling of Through Silicon and Package Vias.

Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung, Madhavan Swaminathan, Rao R. Tummala

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2006

Chip-package hybrid clock distribution network and DLL for low jitter clock delivery.

Daehyun Chung, Chunghyun Ryu, Hyungsoo Kim, Choonheung Lee, Jinhan Kim, Kicheol Bae, Jiheon Yu, Hoi-Jun Yoo, Joungho Kim

IEEE J. Solid State Circuits, 2006