Jianyong Xie

According to our database, Jianyong Xie authored at least 7 papers between 2009 and 2017.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2017

Spike-Like Blending Noise Attenuation Using Structural Low-Rank Decomposition.

Yatong Zhou, Chaojun Shi, Hanming Chen, Jianyong Xie, Guoning Wu, Yangkang Chen

IEEE Geosci. Remote. Sens. Lett., 2017

Application of Principal Component Analysis in Weighted Stacking of Seismic Data.

Jianyong Xie, Wei Chen, Dong Zhang, Shaohuan Zu, Yangkang Chen

IEEE Geosci. Remote. Sens. Lett., 2017

Multiple-Reflection Noise Attenuation Using Adaptive Randomized-Order Empirical Mode Decomposition.

Wei Chen, Jianyong Xie, Shaohuan Zu, Shuwei Gan, Yangkang Chen

IEEE Geosci. Remote. Sens. Lett., 2017

13.6 A 2.4GHz WLAN digital polar transmitter with synthesized digital-to-time converter in 14nm trigate/FinFET technology for IoT and wearable applications.

Paolo Madoglio, Hongtao Xu, Kailash Chandrashekar, Luis Cuellar, Muhammad Faisal, Yee William Li, Hyung Seok Kim, Khoa Minh Nguyen, Yulin Tan, Brent R. Carlton, Vaibhav A. Vaidya, Yanjie Wang, Thomas Tetzlaff, Satoshi Suzuki, Amr Fahim, Parmoon Seddighrad, Jianyong Xie, Zhichao Zhang, Divya Shree Vemparala, Ashoke Ravi, Stefano Pellerano, Yorgos Palaskas

Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017

2013

Electrical and thermal analysis for design exchange formats in three dimensional integrated circuits.

Rishik Bazaz, Jianyong Xie, Madhavan Swaminathan

Proceedings of the International Symposium on Quality Electronic Design, 2013

2012

3D transient thermal solver using non-conformal domain decomposition approach.

Jianyong Xie, Madhavan Swaminathan

Proceedings of the 2012 IEEE/ACM International Conference on Computer-Aided Design, 2012

2009

Electrical-thermal co-analysis for power delivery networks in 3D system integration.

Jianyong Xie, Daehyun Chung, Madhavan Swaminathan, Michael McAllister, Alina Deutsch, Lijun Jiang, Barry J. Rubin

Proceedings of the IEEE International Conference on 3D System Integration, 2009