Dan Wallace

According to our database1, Dan Wallace authored at least 1 paper in 2010.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2010
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications.
Proceedings of the IEEE International Conference on 3D System Integration, 2010


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