Alain Phommahaxay

According to our database1, Alain Phommahaxay authored at least 9 papers between 2007 and 2019.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2019
Process Complexity and Cost Considerations of Multi-Layer Die Stacks.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Protective Layer for Collective Die to Wafer Hybrid Bonding.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2016
Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2011
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
IEEE J. Solid State Circuits, 2011

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

In-line metrology and inspection for process control during 3D stacking of IC's.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

2007
Surface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching
CoRR, 2007


  Loading...