Bart Swinnen

According to our database, Bart Swinnen authored at least 9 papers between 2006 and 2012.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2012

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.

Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen

Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

In-line metrology and inspection for process control during 3D stacking of IC's.

Sandip Halder, Ingrid De Wolf, Alain Phommahaxay, Andy Miller, Mireille Maenhoudt, Gerald Beyer, Bart Swinnen, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications.

Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne, Youssef Travaly, Bart Swinnen

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot.

Paul Marchal, Bruno Bougard, Guruprasad Katti, Michele Stucchi, Wim Dehaene, Antonis Papanikolaou, Diederik Verkest, Bart Swinnen, Eric Beyne

Proc. IEEE, 2009

Impact of 3D design choices on manufacturing cost.

Dimitrios Velenis, Michele Stucchi, Erik Jan Marinissen, Bart Swinnen, Eric Beyne

Proceedings of the IEEE International Conference on 3D System Integration, 2009

3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2008

Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures.

Yu Yang, Hugo Bender, Kai Arstila, Bart Swinnen, Bert Verlinden, Ingrid De Wolf

Microelectron. Reliab., 2008

2006

Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads.

Petar Ratchev, Serguei Stoukatch, Bart Swinnen

Microelectron. Reliab., 2006