Thibault Buisson

According to our database1, Thibault Buisson authored at least 4 papers between 2010 and 2012.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2012
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011
3D stacking using ultra thin dies.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Analysis of microbump induced stress effects in 3D stacked IC technologies.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications.
Proceedings of the IEEE International Conference on 3D System Integration, 2010


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