Sumant Sood

According to our database, Sumant Sood authored at least 2 papers in 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2010

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications.

Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne, Youssef Travaly, Bart Swinnen

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration.

Markus Gabriel, Thomas Knauer, Peter Bisson, Sumant Sood, Wilfried Bair, Jim Hermanowski

Proceedings of the IEEE International Conference on 3D System Integration, 2010