Darong Huang

Orcid: 0000-0002-6579-0627

Affiliations:
  • EPFL, Lausanne, Switzerland
  • University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Films and Integrated Devices, Chengdu, China (former)


According to our database1, Darong Huang authored at least 13 papers between 2019 and 2025.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

Online presence:

On csauthors.net:

Bibliography

2025
CloudFormer: An Attention-based Performance Prediction for Public Clouds with Unknown Workload.
CoRR, September, 2025

GreenLLM: SLO-Aware Dynamic Frequency Scaling for Energy-Efficient LLM Serving.
CoRR, August, 2025

A 20-Year Retrospective on Power and Thermal Modeling and Management.
CoRR, August, 2025

e-GPU: An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications.
CoRR, May, 2025

2024
An Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-Design.
IEEE Trans. Parallel Distributed Syst., November, 2024

Intermediate Address Space: virtual memory optimization of heterogeneous architectures for cache-resident workloads.
ACM Trans. Archit. Code Optim., September, 2024

CloudProphet: A Machine Learning-Based Performance Prediction for Public Clouds.
IEEE Trans. Sustain. Comput., 2024

Is the powersave governor really saving power?
Proceedings of the 24th IEEE International Symposium on Cluster, 2024

2023
REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal.
Proceedings of the 31st IFIP/IEEE International Conference on Very Large Scale Integration, 2023

2022
COCKTAIL: Multicore Co-Optimization Framework With Proactive Reliability Management.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

Reinforcement Learning-Based Joint Reliability and Performance Optimization for Hybrid-Cache Computing Servers.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

2019
Runtime Stress Estimation for Three-dimensional IC Reliability Management Using Artificial Neural Network.
ACM Trans. Design Autom. Electr. Syst., 2019

STREAM: Stress and Thermal Aware Reliability Management for 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019


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