Darong Huang

Orcid: 0000-0002-6579-0627

Affiliations:
  • EPFL, Lausanne, Switzerland
  • University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Films and Integrated Devices, Chengdu, China (former)


According to our database1, Darong Huang authored at least 15 papers between 2019 and 2026.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2026
3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems.
Proceedings of the Design, Automation & Test in Europe Conference, 2026

ETLA-3D: Equivalent Thin Layer Aggregation based Thermal FEM for Hybrid Bonding F2F 3D ICs.
Proceedings of the Design, Automation & Test in Europe Conference, 2026

2025
A 20-Year Retrospective on Power and Thermal Modeling and Management.
IEEE Des. Test, December, 2025

CloudFormer: An Attention-based Performance Prediction for Public Clouds with Unknown Workload.
CoRR, September, 2025

GreenLLM: SLO-Aware Dynamic Frequency Scaling for Energy-Efficient LLM Serving.
CoRR, August, 2025

e-GPU: An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications.
CoRR, May, 2025

2024
An Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-Design.
IEEE Trans. Parallel Distributed Syst., November, 2024

Intermediate Address Space: virtual memory optimization of heterogeneous architectures for cache-resident workloads.
ACM Trans. Archit. Code Optim., September, 2024

CloudProphet: A Machine Learning-Based Performance Prediction for Public Clouds.
IEEE Trans. Sustain. Comput., 2024

Is the powersave governor really saving power?
Proceedings of the 24th IEEE International Symposium on Cluster, 2024

2023
REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal.
Proceedings of the 31st IFIP/IEEE International Conference on Very Large Scale Integration, 2023

2022
COCKTAIL: Multicore Co-Optimization Framework With Proactive Reliability Management.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

Reinforcement Learning-Based Joint Reliability and Performance Optimization for Hybrid-Cache Computing Servers.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

2019
Runtime Stress Estimation for Three-dimensional IC Reliability Management Using Artificial Neural Network.
ACM Trans. Design Autom. Electr. Syst., 2019

STREAM: Stress and Thermal Aware Reliability Management for 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019


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