Valeriy Sukharev

According to our database1, Valeriy Sukharev
  • authored at least 22 papers between 2001 and 2018.
  • has a "Dijkstra number"2 of four.

Timeline

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Bibliography

2018
Power Grid Electromigration Checking Using Physics-Based Models.
IEEE Trans. on CAD of Integrated Circuits and Systems, 2018

2017
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing.
Integration, 2017

Fast physics-based electromigration assessment by efficient solution of linear time-invariant (LTI) systems.
Proceedings of the 2017 IEEE/ACM International Conference on Computer-Aided Design, 2017

2016
Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks.
IEEE Trans. on CAD of Integrated Circuits and Systems, 2016

Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees.
IEEE Trans. on CAD of Integrated Circuits and Systems, 2016

Electromigration assessment for power grid networks considering temperature and thermal stress effects.
Integration, 2016

Fast physics-based electromigration checking for on-die power grids.
Proceedings of the 35th International Conference on Computer-Aided Design, 2016

Learning-based dynamic reliability management for dark silicon processor considering EM effects.
Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition, 2016

Physics-based full-chip TDDB assessment for BEOL interconnects.
Proceedings of the 53rd Annual Design Automation Conference, 2016

Electromigration recovery modeling and analysis under time-dependent current and temperature stressing.
Proceedings of the 21st Asia and South Pacific Design Automation Conference, 2016

2015
Post placement leakage reduction with stress-enhanced filler cells.
Proceedings of the IEEE/ACM International Symposium on Low Power Electronics and Design, 2015

Interconnect reliability modeling and analysis for multi-branch interconnect trees.
Proceedings of the 52nd Annual Design Automation Conference, 2015

New electromigration modeling and analysis considering time-varying temperature and current densities.
Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015

2014
IR-drop based electromigration assessment: parametric failure chip-scale analysis.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

Lifetime optimization for real-time embedded systems considering electromigration effects.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

Physics-based Electromigration Assessment for Power Grid Networks.
Proceedings of the 51st Annual Design Automation Conference 2014, 2014

2012
Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance.
J. Electronic Testing, 2012

2010
Closed-form modeling of layout-dependent mechanical stress.
Proceedings of the 47th Design Automation Conference, 2010

2009
Control of design specific variation in etch-assisted via pattern transfer by means of full-chip simulation.
Proceedings of the 10th International Symposium on Quality of Electronic Design (ISQED 2009), 2009

2005
Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects.
IEEE Trans. on CAD of Integrated Circuits and Systems, 2005

2004
Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect.
Proceedings of the 5th International Symposium on Quality of Electronic Design (ISQED 2004), 2004

2001
Reliability Studies on Multilevel Interconnection with Intermetal Dielectric Air Gaps.
Microelectronics Reliability, 2001


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