F. Duval

According to our database, F. Duval authored at least 1 paper in 2009.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2009

Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping.

Yann Civale, Deniz Sabuncuoglu Tezcan, Harold G. G. Philipsen, P. Jaenen, Rahul Agarwal, F. Duval, Philippe Soussan, Youssef Travaly, Eric Beyne

Proceedings of the IEEE International Conference on 3D System Integration, 2009