According to our database1, Philippe Soussan authored at least 4 papers between 2003 and 2019.
Legend:Book In proceedings Article PhD thesis Other
A 300mm CMOS-Compatible PECVD Silicon Nitride Platform for Integrated Photonics with Low Loss and Low Process Induced Phase Variation.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2019
Proceedings of the IEEE International Conference on 3D System Integration, 2010
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping.
Proceedings of the IEEE International Conference on 3D System Integration, 2009
Advantage of In-situ over Ex-situ techniques as reliability tool: Aging kinetics of Imec's MCM-D discrete passives devices.
Microelectron. Reliab., 2003