Philippe Soussan

According to our database1, Philippe Soussan authored at least 4 papers between 2003 and 2019.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2019
A 300mm CMOS-Compatible PECVD Silicon Nitride Platform for Integrated Photonics with Low Loss and Low Process Induced Phase Variation.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2019

2010
A novel concept for ultra-low capacitance via-last TSV.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping.
Proceedings of the IEEE International Conference on 3D System Integration, 2009

2003
Advantage of In-situ over Ex-situ techniques as reliability tool: Aging kinetics of Imec's MCM-D discrete passives devices.
Microelectron. Reliab., 2003


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