Gopi Neela

Affiliations:
  • University of Southern California, Information Sciences Institute, Los Angeles, USA


According to our database1, Gopi Neela authored at least 10 papers between 2006 and 2019.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2019
Visual Inertial Odometry At the Edge: A Hardware-Software Co-design Approach for Ultra-low Latency and Power.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2019

2015
Congestion-aware optimal techniques for assigning inter-tier signals to 3D-vias in a 3DIC.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014
A multi-mode energy-efficient double-precision floating-point multiplier.
Proceedings of the IEEE 57th International Midwest Symposium on Circuits and Systems, 2014

Modeling the Impact of TSVs on Average Wire Length in 3DICs Using a Tier-Level Hierarchical Approach.
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2014

Optimal techniques for assigning inter-tier signals to 3D-vias with path control in a 3DIC.
Proceedings of the IEEE International Symposium on Circuits and Systemss, 2014

2013
Logic-on-logic partitioning techniques for 3-dimensional integrated circuits.
Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013

An asymmetric adaptive-precision energy-efficient 3DIC multiplier.
Proceedings of the Great Lakes Symposium on VLSI 2013 (part of ECRC), 2013

Techniques for assigning inter-tier signals to bondpoints in a face-to-face bonded 3DIC.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012
Challenges in 3DIC implementation of a design using current CAD tools.
Proceedings of the 55th IEEE International Midwest Symposium on Circuits and Systems, 2012

2006
Low Power Hierarchical Multiplier and Carry Look-Ahead Architecture.
Proceedings of the 2006 IEEE/ACS International Conference on Computer Systems and Applications (AICCSA 2006), 2006


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