Harufumi Kobayashi

According to our database1, Harufumi Kobayashi authored at least 3 papers between 2011 and 2013.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2013
A 100GB/s wide I/O with 4096b TSVs through an active silicon interposer with in-place waveform capturing.
Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013

2011
High density Cu-TSVs and reliability issues.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011


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