Harufumi Kobayashi

According to our database, Harufumi Kobayashi authored at least 3 papers between 2011 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

A 100GB/s wide I/O with 4096b TSVs through an active silicon interposer with in-place waveform capturing.

Satoshi Takaya, Makoto Nagata, Atsushi Sakai, Takashi Kariya, Shiro Uchiyama, Harufumi Kobayashi, Hiroaki Ikeda

Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013

2011

High density Cu-TSVs and reliability issues.

Mariappan Murugesan, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress.

Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011