Jichoel Bea

According to our database, Jichoel Bea authored at least 29 papers between 2009 and 2021.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2021

Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing.

Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2019

Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration.

Mariappan Murugesan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal.

Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, Hiroyuki Hashimoto, Mitsu Koyanagi

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.

Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Micromachines, 2016

Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology.

Mariappan Murugesan, Jichel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications.

Kang Wook Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

New concept of TSV formation methodology using Directed Self-Assembly (DSA).

Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM.

Kang Wook Lee, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study.

Mariappan Murugesan, Jichoel Bea, Hiroyuki Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers.

K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University.

K. W. Lee, Ji Chel Bea, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.

Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI.

Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV.

K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration.

Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kang Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV.

Mariappan Murugesan, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, Yuji Sutou, H. Wang, J. Koike

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory.

Kang Wook Lee, Seiya Tanikawa, Mariappan Murugesan, H. Naganuma, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

3D memory chip stacking by multi-layer self-assembly technology.

Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Ho-Young Son, M.-S. Suh, K.-Y. Byun, N.-S. Kim, Kang Wook Lee, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Development of via-last 3D integration technologies using a new temporary adhesive system.

Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration.

Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Micromachines, 2011

Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI.

Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs.

Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Yuki Ohara, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Temporary bonding strength control for self-assembly-based 3D integration.

Takafumi Fukushima, Yuki Ohara, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.

Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding.

Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature.

Takafumi Fukushima, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.

Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Heterogeneous integration technology for MEMS-LSI multi-chip module.

Kang Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration.

Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009