Jaemin Lim

According to our database, Jaemin Lim authored at least 11 papers between 2015 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Parameter-efficient Fine-tuning of Conformer-based Streaming Speech Recognition into Non-streaming Models.

Yunjae Nam, Jeong U. Han, Kiyeon Kim, Jaemin Lim

Proceedings of the 26th Annual Conference of the International Speech Communication Association, 2025

2024

Wav2vec-VC: Voice Conversion via Hidden Representations of Wav2vec 2.0.

Jaemin Lim, Kiyeon Kim

Proceedings of the IEEE International Conference on Acoustics, 2024

2022

Overo: Sharing Private Audio Recordings.

Jaemin Lim, Kiyeon Kim, Hyunwoo Yu, Suk-Bok Lee

Proceedings of the 2022 ACM SIGSAC Conference on Computer and Communications Security, 2022

2020

Making Connected Cars Untraceable via DSRC Radios.

Jaemin Lim, Kiyeon Kim, Hyunwoo Yu, Suk-Bok Lee

IEEE Access, 2020

2018

Pinto: Enabling Video Privacy for Commodity IoT Cameras.

Hyunwoo Yu, Jaemin Lim, Kiyeon Kim, Suk-Bok Lee

Proceedings of the 2018 ACM SIGSAC Conference on Computer and Communications Security, 2018

2017

Preserving Location Privacy of Connected Vehicles With Highly Accurate Location Updates.

Jaemin Lim, Hyunwoo Yu, Kiyeon Kim, Minho Kim, Suk-Bok Lee

IEEE Commun. Lett., 2017

ViewMap: Sharing Private In-Vehicle Dashcam Videos.

Minho Kim, Jaemin Lim, Hyunwoo Yu, Kiyeon Kim, Younghoon Kim, Suk-Bok Lee

Proceedings of the 14th USENIX Symposium on Networked Systems Design and Implementation, 2017

2015

Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC.

Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim

Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC.

Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim

Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015

Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module.

Hyunsuk Lee, Kyungjun Cho, Heegon Kim, Sumin Choi, Jaemin Lim, Joungho Kim

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.

Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim

Proceedings of the 2015 International 3D Systems Integration Conference, 2015