Marie Denison

According to our database, Marie Denison authored at least 6 papers between 2003 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2016

Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization.

Andres Garcia, Nathan Warner, Nandika Anne D'Souza, Enis Tuncer, Luu Nguyen, Marie Denison, Jeffrey T. Fong

IEEE Trans. Ind. Electron., 2016

2014

TCAD modeling of encapsulation layer in high-voltage, high-temperature operation regime.

I. Imperiale, Susanna Reggiani, Elena Gnani, Antonio Gnudi, Giorgio Baccarani, Luu Nguyen, Marie Denison

Proceedings of the 44th European Solid State Device Research Conference, 2014

2013

Modeling and characterization of hot-carrier stress degradation in power MOSFETs (invited).

Susanna Reggiani, Elena Gnani, Antonio Gnudi, Giorgio Baccarani, Stefano Poli, Rick Wise, Ming-Yeh Chuang, Weidong Tian, Marie Denison

Proceedings of the European Solid-State Device Research Conference, 2013

2005

Automated setup for thermal imaging and electrical degradation study of power DMOS devices.

Michael Heer, Viktor Dubec, M. Blaho, Sergey Bychikhin, Dionyz Pogany, Erich Gornik, Marie Denison, Matthias Stecher, Gerhard Groos

Microelectron. Reliab., 2005

2004

Multiple-time-instant 2D thermal mapping during a single ESD event.

Viktor Dubec, Sergey Bychikhin, M. Blaho, Michael Heer, Dionyz Pogany, Marie Denison, Nils Jensen, Matthias Stecher, Gerhard Groos, Erich Gornik

Microelectron. Reliab., 2004

2003

Study of internal behavior in a vertical DMOS transistor under short high current stress by an interferometric mapping method.

M. Blaho, Dionyz Pogany, Erich Gornik, Marie Denison, Gerhard Groos, Matthias Stecher

Microelectron. Reliab., 2003