Min-Sun Keel

Orcid: 0000-0002-0732-672X

According to our database1, Min-Sun Keel authored at least 12 papers between 2011 and 2023.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2023
Automotive 2.1 μm Full-Depth Deep Trench Isolation CMOS Image Sensor with a 120 dB Single-Exposure Dynamic Range.
Sensors, November, 2023

2021
A 1.2-Mpixel Indirect Time-of-Flight Image Sensor With 4-Tap 3.5-μm Pixels for Peak Current Mitigation and Multi-User Interference Cancellation.
IEEE J. Solid State Circuits, 2021

A 4-tap 3.5 μm 1.2 Mpixel Indirect Time-of-Flight CMOS Image Sensor with Peak Current Mitigation and Multi-User Interference Cancellation.
Proceedings of the IEEE International Solid-State Circuits Conference, 2021

2020
A VGA Indirect Time-of-Flight CMOS Image Sensor With 4-Tap 7- $\mu$ m Global-Shutter Pixel and Fixed-Pattern Phase Noise Self-Compensation.
IEEE J. Solid State Circuits, 2020

A 4-tap global shutter pixel with enhanced IR sensitivity for VGA time-of-flight CMOS image sensors.
Proceedings of the Imaging Sensors and Systems 2020, 2020

2019
A 640×480 Indirect Time-of-Flight CMOS Image Sensor with 4-tap 7-μm Global-Shutter Pixel and Fixed-Pattern Phase Noise Self-Compensation Scheme.
Proceedings of the 2019 Symposium on VLSI Circuits, Kyoto, Japan, June 9-14, 2019, 2019

2016
A Study of BER-Optimal ADC-Based Receiver for Serial Links.
IEEE Trans. Circuits Syst. I Regul. Pap., 2016

2015
Design of reliable and energy-efficient high-speed interface circuits
PhD thesis, 2015

Energy-efficient and high throughput sparse distributed memory architecture.
Proceedings of the 2015 IEEE International Symposium on Circuits and Systems, 2015

An energy-efficient memory-based high-throughput VLSI architecture for convolutional networks.
Proceedings of the 2015 IEEE International Conference on Acoustics, 2015

2014
An energy-efficient VLSI architecture for pattern recognition via deep embedding of computation in SRAM.
Proceedings of the IEEE International Conference on Acoustics, 2014

2011
ESD protection networks for 3D integrated circuits.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011


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