Rajesh Kedia

Orcid: 0000-0003-3711-0396

According to our database1, Rajesh Kedia authored at least 12 papers between 2017 and 2023.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Bibliography

2023
Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure.
ACM Trans. Embed. Comput. Syst., November, 2023

2022
FN-CACTI: Advanced CACTI for FinFET and NC-FinFET Technologies.
IEEE Trans. Very Large Scale Integr. Syst., 2022

CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems.
ACM Trans. Archit. Code Optim., 2022

EXPRESS: CNN EXecution Time PREdiction for DPU DeSign Space Exploration.
Proceedings of the International Conference on Field-Programmable Technology, 2022

CoreMemDTM: Integrated Processor Core and 3D Memory Dynamic Thermal Management for Improved Performance.
Proceedings of the 2022 Design, Automation & Test in Europe Conference & Exhibition, 2022

2021
Leakage-Aware Dynamic Thermal Management of 3D Memories.
ACM Trans. Design Autom. Electr. Syst., 2021

Design Space Exploration of FPGA-Based System With Multiple DNN Accelerators.
IEEE Embed. Syst. Lett., 2021

2020
INFER: INterFerence-aware Estimation of Runtime for Concurrent CNN Execution on DPUs.
Proceedings of the International Conference on Field-Programmable Technology, 2020

2019
MAVI: Mobility Assistant for Visually Impaired with Optional Use of Local and Cloud Resources.
Proceedings of the 32nd International Conference on VLSI Design and 18th International Conference on Embedded Systems, 2019

GRanDE: Graphical Representation and Design Space Exploration of Embedded Systems.
Proceedings of the 22nd Euromicro Conference on Digital System Design, 2019

A case for design space exploration of context-aware adaptive embedded systems: work-in-progress.
Proceedings of the International Conference on Hardware/Software Codesign and System Synthesis Companion, 2019

2017
MAVI: An Embedded Device to Assist Mobility of Visually Impaired.
Proceedings of the 30th International Conference on VLSI Design and 16th International Conference on Embedded Systems, 2017


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