Riko I. Made

According to our database, Riko I. Made authored at least 6 papers between 2010 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Health diagnosis and recuperation of aged Li-ion batteries with data analytics and equivalent circuit modeling.

Riko I. Made, Jing Lin, Jintao Zhang, Yu Zhang, Lionel C. H. Moh, Zhaolin Liu, Ning Ding, Sing Yang Chiam, Edwin Khoo, Xuesong Yin, Guangyuan Wesley Zheng

CoRR, 2023

2017

Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation.

Wardhana A. Sasangka, Govindo J. Syaranamual, Y. Gao, Riko I. Made, Chee Lip Gan, Carl V. Thompson

Microelectron. Reliab., 2017

Characterisation of defects generated during constant current InGaN-on-silicon LED operation.

Riko I. Made, Yu Gao, Govindo J. Syaranamual, Wardhana A. Sasangka, L. Zhang, Xuan Sang Nguyen, Yee Yan Tay, Jason Scott Herrin, Carl V. Thompson, Chee Lip Gan

Microelectron. Reliab., 2017

2016

Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation.

Govindo J. Syaranamual, Wardhana A. Sasangka, Riko I. Made, Subramaniam Arulkumaran, Geok Ing Ng, Siew Chuen Foo, Chee Lip Gan, Carl V. Thompson

Microelectron. Reliab., 2016

2013

Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics.

F. L. Lau, Riko I. Made, Wahyuaji Narottama Putra, J. Z. Lim, V. C. Nachiappan, J. L. Aw, Chee Lip Gan

Microelectron. Reliab., 2013

2010

Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement.

Lan Peng, Hongyu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan

Proceedings of the IEEE International Conference on 3D System Integration, 2010