Lan Peng

According to our database, Lan Peng authored at least 12 papers between 2010 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2022

VeRoViz: A Vehicle Routing Visualization Toolkit.

Lan Peng, Chase C. Murray

INFORMS J. Comput., 2022

2021

ICINet: ICI-Aware Neural Network Based Channel Estimation for Rapidly Time-Varying OFDM Systems.

Yi Sun, Hong Shen, Zhenguo Du, Lan Peng, Chunming Zhao

IEEE Commun. Lett., 2021

2020

Dynamic Edge Access System in IoT Environment.

Huifeng Wu, Danfeng Sun, Lan Peng, Yuan Yao, Jia Wu, Quan Z. Sheng, Yi Yan

IEEE Internet Things J., 2020

2017

Power Allocation for OFDM with Index Modulation.

Qianli Ma, Ping Yang, Pengfei Wang, Lan Peng, Xu He, Bin Fu, Yue Xiao

Proceedings of the 85th IEEE Vehicular Technology Conference, 2017

A fleet-level selective maintenance model for long-distance highway transportation considering stochastic repair quality.

Lan Peng, Lin Ma, Naichao Wang

Proceedings of the 2nd International Conference on System Reliability and Safety, 2017

2016

Subcarrier Allocation for OFDM With Index Modulation.

Qianli Ma, Yue Xiao, Lilin Dan, Ping Yang, Lan Peng, Shaoqian Li

IEEE Commun. Lett., 2016

Performance Analysis of Spatial Modulation OFDM System with N-Continuous Precoder.

Feng Yu, Xia Lei, Lan Peng, Yue Xiao, Peng Wei, Xiaojie Wen

Proceedings of the IEEE 83rd Vehicular Technology Conference, 2016

Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects.

Joeri De Vos, Lan Peng, Alain Phommahaxay, Joost Van Ongeval, Andy Miller, Eric Beyne, Florian Kurz, Thomas Wagenleiter, Markus Wimplinger, Thomas Uhrmann

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Energy-Efficient Proportional Resource Allocation in Uplink OFDMA Systems.

Lan Peng, Saidan Gong, Lilin Dan, Yue Xiao

Proceedings of the IEEE 81st Vehicular Technology Conference, 2015

A modeling and simulation approach for support network considering multi-service flows.

Xiang Li, Lin Ma, Lan Peng, Jingfu Wang

Proceedings of the 2015 IEEE International Conference on Industrial Engineering and Engineering Management, 2015

Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics.

Soon-Wook Kim, Lan Peng, Andy Miller, Gerald Beyer, Eric Beyne, Chung-Sun Lee

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2010

Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement.

Lan Peng, Hongyu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan

Proceedings of the IEEE International Conference on 3D System Integration, 2010