Ryan Clarke

According to our database, Ryan Clarke authored at least 10 papers between 2009 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of three.

2018

Evaluating the Impact of the Girls Who Code Summer Immersion Program: (Abstract Only).

Ryan Clarke, Sarah Judd

Proceedings of the 49th ACM Technical Symposium on Computer Science Education, 2018

Demonstration of superconducting memory for an RQL CPU.

Randall Burnett, Ryan Clarke, Timothy Lee, Harold Hearne, Jacob Vogel, Quentin Herr, Anna Herr

Proceedings of the International Symposium on Memory Systems, 2018

2015

High-speed serial circuits using SiGe HBT BiCMOS technology.

Ryan Clarke

PhD thesis, 2015

High-Speed Reconfigurable Circuits for Multirate Systems in SiGe HBT Technology.

Mitchell R. LeRoy, Srikumar Raman, Michael Chu, Jin Woo Kim, Jong-Ru Guo, Kuan Zhou, Chao You, Ryan Clarke, Bryan S. Goda, John F. McDonald

Proc. IEEE, 2015

140 Gb/s Serializer Using Clock Doublers in 90 nm SiGe Technology.

Ryan Clarke, Mitchell R. LeRoy, Srikumar Raman, Tuhin Guha Neogi, Russell P. Kraft, John F. McDonald

IEEE J. Solid State Circuits, 2015

Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU.

Ryan Clarke, Philip Jacob, Okan Erdogan, Paul Belemijian, Srikumar Raman, Mitchell R. LeRoy, Tuhin Guha Neogi, Russell P. Kraft, Diana-Andra Borca-Tasciuc, John F. McDonald

IEEE Access, 2015

2014

Design of High-Speed Register Files Using SiGe HBT BiCMOS Technology.

Xuelian Liu, Srikumar Raman, Ryan Clarke, Mitchell R. LeRoy, Okan Erdogan, Michael Chu, Alexey Gutin, Russell P. Kraft, John F. McDonald

IEEE Trans. Circuits Syst. II Express Briefs, 2014

Design of BiCMOS SRAMs for high-speed SiGe applications.

Xuelian Liu, Mitchell R. LeRoy, Ryan Clarke, Michael Chu, H. O. Aquino, Srikumar Raman, Aamir Zia, Russell P. Kraft, John F. McDonald

IET Circuits Devices Syst., 2014

2012

A three-dimensional DRAM using floating body cell in FDSOI devices.

Xuelian Liu, Aamir Zia, Mitchell R. LeRoy, Srikumar Raman, Ryan Clarke, Russell P. Kraft, John F. McDonald

Proceedings of the IEEE 15th International Symposium on Design and Diagnostics of Electronic Circuits & Systems, 2012

2009

Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers.

John F. McDonald, Okan Erdogan, Philip Jacob, Paul M. Belemjian, Alexey Gutin, Aamir Zia, Michael Chu, Jin Woo Kim, Ryan Clarke, Nate DeSimone, Sherry Liu, Russell P. Kraft

Proceedings of the IEEE International Conference on 3D System Integration, 2009