Steve S. Chung
  According to our database1,
  Steve S. Chung
  authored at least 12 papers
  between 1999 and 2025.
  
  
Collaborative distances:
Collaborative distances:
Awards
IEEE Fellow
  IEEE Fellow 2006, "For contributions to reliability in ultra-thin-oxide complementary metal oxide semiconductor (CMOS) devices.".
Timeline
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
  2025
Resistive-Gate RAM: An 1TnR Architecture Feasible for Scaling Beyond 16nm CMOS Generation.
    
  
    Proceedings of the IEEE International Reliability Physics Symposium, 2025
    
  
  2024
An Ultra-Low Voltage Auger-Recombination Enhanced Hot Hole Injection Scheme in Implementing a 3 Bits per Cell e-DRAM CIM Macro for Inference Accelerator.
    
  
    Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
    
  
  2023
First Demonstration of a Design Methodology for Highly Reliable Operation at High Temperature on 128kb 1T1C FeRAM Chip.
    
  
    Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
    
  
A World First QLC RRAM: Highly Reliable Resistive-Gate Flash with Record 10<sup>8</sup> Endurance and Excellent Retention.
    
  
    Proceedings of the IEEE International Reliability Physics Symposium, 2023
    
  
  2022
NVDimm-FE: A High-density 3D Architecture of 3-bit/c 2TnCFE to Break Great Memory Wall with 10 ns of PGM-pulse, 10<sup>10</sup> Cycles of Endurance, and Decade Lifetime at 103 °C.
    
  
    Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
    
  
  2021
A Reliable Triple-Level Operation of Resistive-Gate Flash Featuring Forming-Free and High Immunity to Sneak Path.
    
  
    Proceedings of the IEEE International Reliability Physics Symposium, 2021
    
  
  2020
A Pulsed RTN Transient Measurement Technique: Demonstration on the Understanding of the Switching in Resistance Memory.
    
  
    Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020
    
  
  2019
The Demonstration of Gate Dielectric-fuse 4kb OTP Memory Feasible for Embedded Applications in High-k Metal-gate CMOS Generations and Beyond.
    
  
    Proceedings of the 2019 Symposium on VLSI Circuits, Kyoto, Japan, June 9-14, 2019, 2019
    
  
    Proceedings of the 13th IEEE International Conference on ASIC, 2019
    
  
  2018
Nonvolatile Crossbar 2D2R TCAM with Cell Size of 16.3 F<sup>2</sup> and K-means Clustering for Power Reduction.
    
  
    Proceedings of the IEEE Asian Solid-State Circuits Conference, 2018
    
  
  2017
    Model. Assist. Stat. Appl., 2017
    
  
  1999
    Proceedings of the 1999 Conference on Asia South Pacific Design Automation, 1999