According to our database1, Suresh Ramalingam authored at least 4 papers between 2012 and 2016.
Legend:Book In proceedings Article PhD thesis Other
HBM package integration: Technology trends, challenges and applications.
Proceedings of the 2016 IEEE Hot Chips 28 Symposium (HCS), 2016
Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Interconnect and package design of a heterogeneous stacked-silicon FPGA.
Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 2013
Advancing high performance heterogeneous integration through die stacking.
Proceedings of the 38th European Solid-State Circuit conference, 2012