Xin Huang

Affiliations:

University of California at Riverside, Department of Electrical and Computer Engineering, CA, USA

According to our database¹, Xin Huang authored at least 20 papers between 2013 and 2017.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

Timeline

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In proceedings

Article

PhD thesis

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Links

On csauthors.net:

Bibliography

2017

Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing.

[BibT_eX]

[DOI]

Integr., 2017

2016

Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks.

[BibT_eX]

[DOI]

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016

Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees.

[BibT_eX]

[DOI]

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016

Electromigration assessment for power grid networks considering temperature and thermal stress effects.

[BibT_eX]

[DOI]

Integr., 2016

EM-Based On-Chip Aging Sensor for Detection of Recycled ICs.

[BibT_eX]

[DOI]

Kai He

Xin Huang

Sheldon X.-D. Tan

IEEE Des. Test, 2016

Voltage-based electromigration immortality check for general multi-branch interconnects.

[BibT_eX]

[DOI]

Proceedings of the 35th International Conference on Computer-Aided Design, 2016

Learning-based dynamic reliability management for dark silicon processor considering EM effects.

[BibT_eX]

[DOI]

Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition, 2016

Physics-based full-chip TDDB assessment for BEOL interconnects.

[BibT_eX]

[DOI]

Proceedings of the 53rd Annual Design Automation Conference, 2016

Electromigration recovery modeling and analysis under time-dependent current and temperature stressing.

[BibT_eX]

[DOI]

Proceedings of the 21st Asia and South Pacific Design Automation Conference, 2016

2015

Task Migrations for Distributed Thermal Management Considering Transient Effects.

[BibT_eX]

[DOI]

IEEE Trans. Very Large Scale Integr. Syst., 2015

<i>H</i>-Matrix-Based Finite-Element-Based Thermal Analysis for 3D ICs.

[BibT_eX]

[DOI]

ACM Trans. Design Autom. Electr. Syst., 2015

H<sup>2</sup>-matrix-based finite element linear solver for fast transient thermal analysis of high-performance ICs.

[BibT_eX]

[DOI]

Int. J. Circuit Theory Appl., 2015

EM-Based on-Chip Aging Sensor for Detection and Prevention of Counterfeit and Recycled ICs.

[BibT_eX]

[DOI]

Kai He

Xin Huang

Sheldon X.-D. Tan

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2015

Interconnect reliability modeling and analysis for multi-branch interconnect trees.

[BibT_eX]

[DOI]

Proceedings of the 52nd Annual Design Automation Conference, 2015

New electromigration modeling and analysis considering time-varying temperature and current densities.

[BibT_eX]

[DOI]

Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015

2014

Direct finite-element-based solver for 3D-IC thermal analysis via H-matrix representation.

[BibT_eX]

[DOI]

Proceedings of the Fifteenth International Symposium on Quality Electronic Design, 2014

IR-drop based electromigration assessment: parametric failure chip-scale analysis.

[BibT_eX]

[DOI]

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

Accurate full-chip estimation of power map, current densities and temperature for EM assessment.

[BibT_eX]

[DOI]

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

Physics-based Electromigration Assessment for Power Grid Networks.

[BibT_eX]

[DOI]

Proceedings of the 51st Annual Design Automation Conference 2014, 2014

2013

Distributed task migration for thermal hot spot reduction in many-core microprocessors.

[BibT_eX]

[DOI]

Proceedings of the IEEE 10th International Conference on ASIC, 2013

Xin Huang

Timeline

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On csauthors.net:

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