Zeyu Sun

According to our database, Zeyu Sun authored at least 26 papers between 2016 and 2021.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2021

A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects.

Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2021

2020

Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires.

Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao

IEEE Trans. Very Large Scale Integr. Syst., 2020

Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs.

Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020

Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip.

Sheldon X.-D. Tan, Zeyu Sun, Sheriff Sadiqbatcha

IPSJ Trans. Syst. LSI Des. Methodol., 2020

EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects.

Wentian Jin, Sheriff Sadiqbatcha, Zeyu Sun, Han Zhou, Sheldon X.-D. Tan

Proceedings of the 38th IEEE International Conference on Computer Design, 2020

Reliable Power Grid Network Design Framework Considering EM Immortalities for Multi-Segment Wires.

Han Zhou, Shuyuan Yu, Zeyu Sun, Sheldon X.-D. Tan

Proceedings of the 25th Asia and South Pacific Design Automation Conference, 2020

2019

EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks.

Han Zhou, Zeyu Sun, Sheriff Sadiqbatcha, Naehyuck Chang, Sheldon X.-D. Tan

IEEE Trans. Very Large Scale Integr. Syst., 2019

Saturation-Volume Estimation for Multisegment Copper Interconnect Wires.

Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan

IEEE Trans. Very Large Scale Integr. Syst., 2019

Reliability based hardware Trojan design using physics-based electromigration models.

Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan

Integr., 2019

Dynamic Reliability Management for Multi-Core Processor Based on Deep Reinforcement Learning.

Zeyu Sun, Han Zhou, Sheldon X.-D. Tan

Proceedings of the 16th International Conference on Synthesis, 2019

Long-Term Reliability Management For Multitasking GPGPUs.

Zeyu Sun, Taeyoung Kim, Marcus Chow, Shaoyi Peng, Han Zhou, Hyoseung Kim, Daniel Wong, Sheldon X.-D. Tan

Proceedings of the 16th International Conference on Synthesis, 2019

2018

Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs.

Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori

IEEE Trans. Very Large Scale Integr. Syst., 2018

Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method.

Chase Cook, Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan

IEEE Trans. Very Large Scale Integr. Syst., 2018

Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires.

Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2018

Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited).

Sheldon X.-D. Tan, Hussam Amrouch, Taeyoung Kim, Zeyu Sun, Chase Cook, Jörg Henkel

Integr., 2018

Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy.

Taeyoung Kim, Sheldon X.-D. Tan, Chase Cook, Zeyu Sun

Integr., 2018

Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires.

Sheriff Sadiqbatcha, Chase Cook, Zeyu Sun, Sheldon X.-D. Tan

Proceedings of the 15th International Conference on Synthesis, 2018

Electromigration-lifetime constrained power grid optimization considering multi-segment interconnect wires.

Han Zhou, Yijing Sun, Zeyu Sun, Hengyang Zhao, Sheldon X.-D. Tan

Proceedings of the 23rd Asia and South Pacific Design Automation Conference, 2018

Accelerating electromigration aging for fast failure detection for nanometer ICs.

Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan

Proceedings of the 23rd Asia and South Pacific Design Automation Conference, 2018

2017

Energy and Lifetime Optimizations for Dark Silicon Manycore Microprocessor Considering Both Hard and Soft Errors.

Taeyoung Kim, Zeyu Sun, Hai-Bao Chen, Hai Wang, Sheldon X.-D. Tan

IEEE Trans. Very Large Scale Integr. Syst., 2017

Leveraging recovery effect to reduce electromigration degradation in power/ground TSV.

Shengcheng Wang, Zeyu Sun, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori

Proceedings of the 2017 IEEE/ACM International Conference on Computer-Aided Design, 2017

Dynamic temperature-aware reliability modeling for multi-branch interconnect trees.

Jiangtao Peng, Hai-Bao Chen, Hengyang Zhao, Zeyu Sun, Sheldon X.-D. Tan

Proceedings of the 12th IEEE International Conference on ASIC, 2017

2016

Finite difference method for electromigration analysis of multi-branch interconnects.

Chase Cook, Zeyu Sun, Taeyoung Kim, Sheldon X.-D. Tan

Proceedings of the 13th International Conference on Synthesis, 2016

Voltage-based electromigration immortality check for general multi-branch interconnects.

Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim, Xin Huang, Sheldon X.-D. Tan

Proceedings of the 35th International Conference on Computer-Aided Design, 2016

Dynamic reliability management for near-threshold dark silicon processors.

Taeyoung Kim, Zeyu Sun, Chase Cook, Jagadeesh Gaddipati, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan

Proceedings of the 35th International Conference on Computer-Aided Design, 2016

Invited - Cross-layer modeling and optimization for electromigration induced reliability.

Taeyoung Kim, Zeyu Sun, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong, Sheldon X.-D. Tan

Proceedings of the 53rd Annual Design Automation Conference, 2016