Yining Chen

Orcid: 0000-0001-9302-6696

Affiliations:
  • Zhejiang University, Hangzhou, Zhejiang, China


According to our database1, Yining Chen authored at least 15 papers between 2023 and 2026.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of five.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2026
A Hybrid Weakly Supervised Approach for enhanced High-Precision SEM Defect Segmentation in Nanoscale Semiconductor Manufacturing.
ACM Trans. Design Autom. Electr. Syst., March, 2026

A survey on semiconductor wafer yield prediction by artificial intelligence.
Microelectron. J., 2026

AMBCT: Adaptive multi-view Bayesian co-training for semi-supervised virtual metrology.
Expert Syst. Appl., 2026

REDM: Regression-Guided Diffusion Modeling for Universal Soft Sensor Enhancement in Semiconductor Process Control.
Proceedings of the 31st Asia and South Pacific Design Automation Conference, 2026

2025
SCSNet: a novel transformer-CNN fusion architecture for enhanced segmentation and classification on high-resolution semiconductor micro-scale defects.
Appl. Intell., April, 2025

A novel joint segmentation approach for wafer surface defect classification based on blended network structure.
J. Intell. Manuf., March, 2025

SPPE-GAN: A novel model for Die-to-Database alignment and SEM distortion correction framework.
Expert Syst. Appl., 2025

Yield Diagnosis and Tuning for Emerging Semiconductors During Research Stage.
IEEE Access, 2025

KARMAD: KAN-Based Adversarial Robust Model for Anomaly Detection.
Proceedings of the 41st IEEE International Conference on Data Engineering, 2025

DefectTrackNet: Efficient Root Cause Analysis of Wafer Defects in Semiconductor Manufacturing Using a Lightweight CNN-Transformer Architecture.
Proceedings of the 30th Asia and South Pacific Design Automation Conference, 2025

2024
Explainable prediction of deposited film thickness in IC fabrication with CatBoost and SHapley Additive exPlanations (SHAP) models.
Appl. Intell., January, 2024

DeepSEM-Net: Enhancing SEM defect analysis in semiconductor manufacturing with a dual-branch CNN-Transformer architecture.
Comput. Ind. Eng., 2024

SEM-CLIP: Precise Few-Shot Learning for Nanoscale Defect Detection in Scanning Electron Microscope Image.
Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024

Minimizing Labeling, Maximizing Performance: A Novel Approach to Nanoscale Scanning Electron Microscope (SEM) Defect Segmentation.
Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024

2023
A Method of Predicting the Deposited Film Thickness in IC Fabrication Based on Stacking Ensemble Learning.
Proceedings of the 2023 7th International Conference on Computer Science and Artificial Intelligence, 2023


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