Yining Chen
Orcid: 0000-0001-9302-6696Affiliations:
- Zhejiang University, Hangzhou, Zhejiang, China
According to our database1,
Yining Chen authored at least 15 papers
between 2023 and 2026.
Collaborative distances:
Collaborative distances:
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Bibliography
2026
A Hybrid Weakly Supervised Approach for enhanced High-Precision SEM Defect Segmentation in Nanoscale Semiconductor Manufacturing.
ACM Trans. Design Autom. Electr. Syst., March, 2026
Microelectron. J., 2026
AMBCT: Adaptive multi-view Bayesian co-training for semi-supervised virtual metrology.
Expert Syst. Appl., 2026
REDM: Regression-Guided Diffusion Modeling for Universal Soft Sensor Enhancement in Semiconductor Process Control.
Proceedings of the 31st Asia and South Pacific Design Automation Conference, 2026
2025
SCSNet: a novel transformer-CNN fusion architecture for enhanced segmentation and classification on high-resolution semiconductor micro-scale defects.
Appl. Intell., April, 2025
A novel joint segmentation approach for wafer surface defect classification based on blended network structure.
J. Intell. Manuf., March, 2025
SPPE-GAN: A novel model for Die-to-Database alignment and SEM distortion correction framework.
Expert Syst. Appl., 2025
IEEE Access, 2025
Proceedings of the 41st IEEE International Conference on Data Engineering, 2025
DefectTrackNet: Efficient Root Cause Analysis of Wafer Defects in Semiconductor Manufacturing Using a Lightweight CNN-Transformer Architecture.
Proceedings of the 30th Asia and South Pacific Design Automation Conference, 2025
2024
Explainable prediction of deposited film thickness in IC fabrication with CatBoost and SHapley Additive exPlanations (SHAP) models.
Appl. Intell., January, 2024
DeepSEM-Net: Enhancing SEM defect analysis in semiconductor manufacturing with a dual-branch CNN-Transformer architecture.
Comput. Ind. Eng., 2024
SEM-CLIP: Precise Few-Shot Learning for Nanoscale Defect Detection in Scanning Electron Microscope Image.
Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024
Minimizing Labeling, Maximizing Performance: A Novel Approach to Nanoscale Scanning Electron Microscope (SEM) Defect Segmentation.
Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024
2023
A Method of Predicting the Deposited Film Thickness in IC Fabrication Based on Stacking Ensemble Learning.
Proceedings of the 2023 7th International Conference on Computer Science and Artificial Intelligence, 2023