Arvind Sridhar

According to our database1, Arvind Sridhar
  • authored at least 19 papers between 2009 and 2018.
  • has a "Dijkstra number"2 of four.

Timeline

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Links

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Bibliography

2018
PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays.
IEEE Trans. Computers, 2018

2017
Internet of the body and cognitive companion: Enabling high-quality monitoring of patients at home.
Proceedings of the 19th IEEE International Conference on e-Health Networking, 2017

Internet of the Body and Cognitive Hypervisor.
Proceedings of the Second IEEE/ACM International Conference on Connected Health: Applications, 2017

2015
ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2015

2014
A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs.
IEEE Trans. on CAD of Integrated Circuits and Systems, 2014

3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs.
IEEE Trans. Computers, 2014

PowerCool: simulation of integrated microfluidic power generation in bright silicon MPSoCs.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

Integrated microfluidic power generation and cooling for bright silicon MPSoCs.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2014

2013
GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation.
IEEE Trans. on CAD of Integrated Circuits and Systems, 2013

STEAM: a fast compact thermal model for two-phase cooling of integrated circuits.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2013

2012
Neural Network-Based Thermal Simulation of Integrated Circuits on GPUs.
IEEE Trans. on CAD of Integrated Circuits and Systems, 2012

Tutorial T7A: New Modeling Methodologies for Thermal Analysis of 3D ICs and Advanced Cooling Technologies of the Future.
Proceedings of the 25th International Conference on VLSI Design, 2012

Accelerating thermal simulations of 3D ICs with liquid cooling using neural networks.
Proceedings of the Great Lakes Symposium on VLSI 2012, 2012

Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation.
Proceedings of the 2012 Design, Automation & Test in Europe Conference & Exhibition, 2012

2011
Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs.
Proceedings of the 2011 International Symposium on Low Power Electronics and Design, 2011

Towards thermally-aware design of 3D MPSoCs with inter-tier cooling.
Proceedings of the Design, Automation and Test in Europe, 2011

2010
Thermal modeling and analysis of 3D multi-processor chips.
Integration, 2010

3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling.
Proceedings of the 2010 International Conference on Computer-Aided Design, 2010

2009
Through Silicon Via-Based Grid for Thermal Control in 3D Chips.
Proceedings of the Nano-Net - 4th International ICST Conference, 2009


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