Arvind Sridhar

According to our database, Arvind Sridhar authored at least 23 papers between 2009 and 2020.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2020

Firefighter Virtual Reality Simulation for Personalized Stress Detection.

Soeren Klingner, Zhiwei Han, Yuanting Liu, Fan Fan, Bashar Altakrouri, Bruno Michel, Jonas R. M. Weiss, Arvind Sridhar, Sophie Mai Chau

Proceedings of the KI 2020: Advances in Artificial Intelligence, 2020

2019

DeStress: Deep Learning for Unsupervised Identification of Mental Stress in Firefighters from Heart-rate Variability (HRV) Data.

Ali Oskooei, Sophie Mai Chau, Jonas R. M. Weiss, Arvind Sridhar, María Rodríguez Martínez, Bruno Michel

CoRR, 2019

Internet of the Body - Wearable Monitoring and Coaching.

Thomas Brunschwiler, Jonas R. M. Weiss, Stephan Paredes, Arvind Sridhar, Ulrike Pluntke, Sophie Mai Chau, Sebastian Gerke, Jorge Barroso, Emanuel Loertscher, Yuksel Temiz, Patrick W. Ruch, Bruno Michel, Sufi Zafar, Theodore G. van Kessel

Proceedings of the 2019 Global IoT Summit, 2019

Evaluation and Classification of Physical and Psychological Stress in Firefighters using Heart Rate Variability.

Ulrike Pluntke, Sebastian Gerke, Arvind Sridhar, Jonas R. M. Weiss, Bruno Michel

Proceedings of the 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2019

2018

PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays.

Artem Aleksandrovich Andreev, Arvind Sridhar, Mohamed M. Sabry, Marina Zapater, Patrick W. Ruch, Bruno Michel, David Atienza

IEEE Trans. Computers, 2018

2017

Internet of the body and cognitive companion: Enabling high-quality monitoring of patients at home.

Rahel Straessle, Yuksel Temiz, Sebastian Gerke, Jonas R. M. Weiss, Arvind Sridhar, Stephan Paredes, Thomas Brunschwiler, Emanuel Loertscher, Neil Ebejer, Bruno Michel, T. van Kessel, Ismael Faro, Sufi Zafar, Frank Libsch, Marc A. Taubenblatt, Keiji Matsumoto

Proceedings of the 19th IEEE International Conference on e-Health Networking, 2017

Internet of the Body and Cognitive Hypervisor.

Rahel Strässle, Sebastian Gerke, Thomas Brunschwiler, Yuksel Temiz, Jonas R. M. Weiss, Arvind Sridhar, Stephan Paredes, Emanuel Loertscher, Neil Ebejer, Bruno Michel, H.-M. Lee, C. Alvarado, Ismael Faro, T. van Kessel, Mounir Meghelli, Marc A. Taubenblatt, Sufi Zafar, Frank Libsch, Keiji Matsumoto

Proceedings of the Second IEEE/ACM International Conference on Connected Health: Applications, 2017

2015

ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network.

Arvind Sridhar, Mohamed M. Sabry, David Atienza

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2015

2014

A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs.

Arvind Sridhar, Mohamed M. Sabry, David Atienza

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014

3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs.

Arvind Sridhar, Alessandro Vincenzi, David Atienza, Thomas Brunschwiler

IEEE Trans. Computers, 2014

PowerCool: simulation of integrated microfluidic power generation in bright silicon MPSoCs.

Arvind Sridhar, Mohamed M. Sabry, Patrick W. Ruch, David Atienza, Bruno Michel

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

Integrated microfluidic power generation and cooling for bright silicon MPSoCs.

Mohamed M. Sabry, Arvind Sridhar, David Atienza, Patrick W. Ruch, Bruno Michel

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2014

2013

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation.

Mohamed M. Sabry, Arvind Sridhar, Jie Meng, Ayse K. Coskun, David Atienza

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013

STEAM: a fast compact thermal model for two-phase cooling of integrated circuits.

Arvind Sridhar, Yassir Madhour, David Atienza, Thomas Brunschwiler, John Richard Thome

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2013

2012

Neural Network-Based Thermal Simulation of Integrated Circuits on GPUs.

Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, David Atienza

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012

Tutorial T7A: New Modeling Methodologies for Thermal Analysis of 3D ICs and Advanced Cooling Technologies of the Future.

David Atienza, Arvind Sridhar

Proceedings of the 25th International Conference on VLSI Design, 2012

Accelerating thermal simulations of 3D ICs with liquid cooling using neural networks.

Alessandro Vincenzi, Arvind Sridhar, Martino Ruggiero, David Atienza

Proceedings of the Great Lakes Symposium on VLSI 2012, 2012

Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation.

Mohamed M. Sabry, Arvind Sridhar, David Atienza

Proceedings of the 2012 Design, Automation & Test in Europe Conference & Exhibition, 2012

2011

Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs.

Alessandro Vincenzi, Arvind Sridhar, Martino Ruggiero, David Atienza

Proceedings of the 2011 International Symposium on Low Power Electronics and Design, 2011

Towards thermally-aware design of 3D MPSoCs with inter-tier cooling.

Mohamed M. Sabry, Arvind Sridhar, David Atienza, Yuksel Temiz, Yusuf Leblebici, S. Szczukiewicz, Navid Borhani, John Richard Thome, Thomas Brunschwiler, Bruno Michel

Proceedings of the Design, Automation and Test in Europe, 2011

2010

Thermal modeling and analysis of 3D multi-processor chips.

José L. Ayala, Arvind Sridhar, David Cuesta

Integr., 2010

3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling.

Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, Thomas Brunschwiler, David Atienza

Proceedings of the 2010 International Conference on Computer-Aided Design, 2010

2009

Through Silicon Via-Based Grid for Thermal Control in 3D Chips.

José L. Ayala, Arvind Sridhar, Vinod Pangracious, David Atienza, Yusuf Leblebici

Proceedings of the Nano-Net - 4th International ICST Conference, 2009