Stephan Paredes

According to our database, Stephan Paredes authored at least 16 papers between 2009 and 2020.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2020

Study of burst-mode adaptive equalization for >25G PON applications [Invited].

Gertjan Coudyzer, Peter Ossieur, Laurens Breyne, Antonio La Porta, Stephan Paredes, Johan Bauwelinck, Xin Yin

JOCN, 2020

2019

A portable potentiometric electronic tongue leveraging smartphone and cloud platforms.

Patrick W. Ruch, Rui Hu, Luca Capua, Yuksel Temiz, Stephan Paredes, Antonio Lopez Marin, Jorge Barroso Carmona, Aaron Cox, Eiji Nakamura, Keiji Matsumoto

CoRR, 2019

A portable potentiometric electronic tongue leveraging smartphone and cloud platforms.

Patrick W. Ruch, Rui Hu, Luca Capua, Yuksel Temiz, Stephan Paredes, Antonio Lopez Marin, Jorge Barroso, Aaron Cox, Eiji Nakamura, Keiji Matsumoto

Proceedings of the IEEE International Symposium on Olfaction and Electronic Nose, 2019

Internet of the Body - Wearable Monitoring and Coaching.

Thomas Brunschwiler, Jonas R. M. Weiss, Stephan Paredes, Arvind Sridhar, Ulrike Pluntke, Sophie Mai Chau, Sebastian Gerke, Jorge Barroso, Emanuel Loertscher, Yuksel Temiz, Patrick W. Ruch, Bruno Michel, Sufi Zafar, Theodore G. van Kessel

Proceedings of the 2019 Global IoT Summit, 2019

2017

Objective, innovation and impact of the energy-efficient dome microdatacenter.

Ronald P. Luijten, Andreas C. Döring, Stephan Paredes, Ton Engbersen, Fred Buining, Bruno Michel

Proceedings of the 2017 International Conference on Advances in Computing, 2017

An FPGA Platform for Hyperscalers.

François Abel, Jagath Weerasinghe, Christoph Hagleitner, Beat Weiss, Stephan Paredes

Proceedings of the 25th IEEE Annual Symposium on High-Performance Interconnects, 2017

Internet of the body and cognitive companion: Enabling high-quality monitoring of patients at home.

Rahel Straessle, Yuksel Temiz, Sebastian Gerke, Jonas R. M. Weiss, Arvind Sridhar, Stephan Paredes, Thomas Brunschwiler, Emanuel Loertscher, Neil Ebejer, Bruno Michel, T. van Kessel, Ismael Faro, Sufi Zafar, Frank Libsch, Marc A. Taubenblatt, Keiji Matsumoto

Proceedings of the 19th IEEE International Conference on e-Health Networking, 2017

Internet of the Body and Cognitive Hypervisor.

Rahel Strässle, Sebastian Gerke, Thomas Brunschwiler, Yuksel Temiz, Jonas R. M. Weiss, Arvind Sridhar, Stephan Paredes, Emanuel Loertscher, Neil Ebejer, Bruno Michel, H.-M. Lee, C. Alvarado, Ismael Faro, T. van Kessel, Mounir Meghelli, Marc A. Taubenblatt, Sufi Zafar, Frank Libsch, Keiji Matsumoto

Proceedings of the Second IEEE/ACM International Conference on Connected Health: Applications, 2017

2015

From Cooling Integrated Circuits to Efficient Electrical Power Generation.

Stephan Paredes, Brian Burg, Patrick W. Ruch, Gerhard Ingmar Meijer, Bruno Michel

ERCIM News, 2015

A Record-Setting Microserver: A Data-Centre in a Shoebox.

Matteo Cossale, Rolf Clauberg, Andreas C. Döring, Ronald P. Luijten, Bruno Michel, Stephan Paredes

ERCIM News, 2015

2014

Dual function heat-spreading and performance of the IBM/ASTRON DOME 64-bit μServer demonstrator.

Ronald P. Luijten, Andreas C. Döring, Stephan Paredes

Proceedings of the 2014 IEEE International Conference on IC Design & Technology, 2014

2013

Roadmap towards ultimately-efficient zeta-scale datacenters.

Patrick W. Ruch, Thomas Brunschwiler, Stephan Paredes, Gerhard Ingmar Meijer, Bruno Michel

Proceedings of the Design, Automation and Test in Europe, 2013

2012

Bionic Packaging: A Promising Paradigm for Future Computing.

Patrick W. Ruch, Thomas Brunschwiler, Werner Escher, Stephan Paredes, Bruno Michel

ERCIM News, 2012

2011

Toward five-dimensional scaling: How density improves efficiency in future computers.

Patrick W. Ruch, Thomas Brunschwiler, Werner Escher, Stephan Paredes, Bruno Michel

IBM J. Res. Dev., 2011

2009

Using Waste Heat from Data Centres to Minimize Carbon Dioxide Emission.

Gerhard Ingmar Meijer, Thomas Brunschwiler, Stephan Paredes, Bruno Michel

ERCIM News, 2009

Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks.

Thomas Brunschwiler, Stephan Paredes, Ute Drechsler, Bruno Michel, W. Cesar, G. Töral, Yuksel Temiz, Yusuf Leblebici

Proceedings of the IEEE International Conference on 3D System Integration, 2009