Yuksel Temiz

According to our database1, Yuksel Temiz authored at least 12 papers between 2009 and 2022.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2022
Live Demonstration: An AI-assisted e-tongue for fast and portable fingerprinting of liquids.
Proceedings of the 2022 IEEE Sensors, Dallas, TX, USA, October 30 - Nov. 2, 2022, 2022

2019
A portable potentiometric electronic tongue leveraging smartphone and cloud platforms.
CoRR, 2019

A portable potentiometric electronic tongue leveraging smartphone and cloud platforms.
Proceedings of the IEEE International Symposium on Olfaction and Electronic Nose, 2019


An earbud-type wearable (A hearable) with vital parameter sensors for early detection and prevention of heat-stroke.
Proceedings of the 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2019

2017
Internet of the body and cognitive companion: Enabling high-quality monitoring of patients at home.
Proceedings of the 19th IEEE International Conference on e-Health Networking, 2017

Internet of the Body and Cognitive Hypervisor.
Proceedings of the Second IEEE/ACM International Conference on Connected Health: Applications, 2017

2013
A 0.18 $\mu {\rm m}$ Biosensor Front-End Based on $1/f$ Noise, Distortion Cancelation and Chopper Stabilization Techniques.
IEEE Trans. Biomed. Circuits Syst., 2013

2012
Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology.
IEEE J. Emerg. Sel. Topics Circuits Syst., 2012

2011
Towards thermally-aware design of 3D MPSoCs with inter-tier cooling.
Proceedings of the Design, Automation and Test in Europe, 2011

2010
Integrating bio-sensing functions on CMOS chips.
Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems, 2010

2009
Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks.
Proceedings of the IEEE International Conference on 3D System Integration, 2009


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