Aurélie Thuaire

According to our database, Aurélie Thuaire authored at least 2 papers between 2010 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.

Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon

Microelectron. Reliab., 2013

2010

A successful implementation of dual damascene architecture to copper TSV for 3D high density applications.

Rebha El Farhane, Myriam Assous, Patrick Leduc, Aurélie Thuaire, David Bouchu, Hélène Feldis, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2010