Myriam Assous

According to our database, Myriam Assous authored at least 8 papers between 2007 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

A 3.19pJ/b Electro-Optical Router with 18ns Setup Frame-Level Routing and 1-to-6 Wavelength-Flexible Link Capacity for Photonic Interposers.

Yvain Thonnart, Christian Bernard, Stéphane Bernabé, Myriam Assous, Laura Boutafa, Benoît Charbonnier, Rémi Franiatte, César Fuguet, Olivier Guille, Vincent Josselin, Stephane Malhouitre, Laurent Mendizabal, Andre Myko, Damien Saint-Patrice, Remi Velard, Jean Charbonnier

Proceedings of the IEEE International Solid-State Circuits Conference, 2026

2022

Specificities of linear Si QD arrays integration and characterization.

Heimanu Niebojewski, Benoit Bertrand, Etienne Nowak, Thomas Bedecarrats, Bruna Cardoso Paz, Lauriane Contamin, Pierre-André Mortemousque, V. Labracherie, L. Brevard, H. Sahin, Jean Charbonnier, C. Thomas, Myriam Assous, Mikaël Cassé, Matias Urdampilleta, Yann-Michel Niquet, François Perruchot, Fred Gaillard, Silvano De Franceschi, Tristan Meunier, Maud Vinet

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2020

POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems.

Yvain Thonnart, Stéphane Bernabé, Jean Charbonnier, Christian Bernard, David Coriat, César Fuguet Tortolero, Pierre Tissier, Benoît Charbonnier, Stéphane Malhouitre, Damien Saint-Patrice, Myriam Assous, Aditya Narayan, Ayse K. Coskun, Denis Dutoit, Pascal Vivet

Proceedings of the 2020 Design, Automation & Test in Europe Conference & Exhibition, 2020

2010

A successful implementation of dual damascene architecture to copper TSV for 3D high density applications.

Rebha El Farhane, Myriam Assous, Patrick Leduc, Aurélie Thuaire, David Bouchu, Hélène Feldis, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

First integration of Cu TSV using die-to-wafer direct bonding and planarization.

Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2009

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits.

Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2007

Development of a permittivity extraction method for ultra low k dielectrics integrated in advanced interconnects.

Olga Cueto, Myriam Assous, François de Crecy, A. Toffoli, David Bouchu, M. Fayolle, Frédéric Boulanger

Microelectron. Reliab., 2007