Nicolas Sillon

According to our database, Nicolas Sillon authored at least 6 papers between 2009 and 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2011

3D integration demonstration of a wireless product with design partitioning.

G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, Jean-Philippe Colonna, Perceval Coudrain, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, Nicolas Hotellier, F. Leverd, R. Liou, Jean Michailos, A. Ostrovsky, Sebastien Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

A successful implementation of dual damascene architecture to copper TSV for 3D high density applications.

Rebha El Farhane, Myriam Assous, Patrick Leduc, Aurélie Thuaire, David Bouchu, Hélène Feldis, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

System on Wafer: A New Silicon Concept in SiP.

Gilles Poupon, Nicolas Sillon, David Henry, Charlotte Gillot, Alan Mathewson, Léa Di Cioccio, Barbara Charlet, Patrick Leduc, Maud Vinet, Perrine Batude

Proc. IEEE, 2009

First integration of Cu TSV using die-to-wafer direct bonding and planarization.

Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2009

3D integration technology for set-top box application.

David Henry, Séverine Cheramy, Jean Charbonnier, Pascal Chausse, Muriel Neyret, Cathy Brunet-Manquat, Sophie Verrun, Nicolas Sillon, Laurent Bonnot, Xavier Gagnard, E. Saugier

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits.

Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey

Proceedings of the IEEE International Conference on 3D System Integration, 2009