Lucile Arnaud

Orcid: 0000-0002-1481-5302

According to our database1, Lucile Arnaud authored at least 12 papers between 2013 and 2022.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2022
Apocalypse Dog.
Proceedings of the SIGGRAPH Asia 2022 Computer Animation Festival, 2022

2021
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management.
IEEE J. Solid State Circuits, 2021

3D interconnection using copper direct hybrid bonding for GaN on silicon wafer.
Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2020
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm<sup>2</sup> Inter-Chiplet Interconnects and 156mW/mm<sup>2</sup>@ 82%-Peak-Efficiency DC-DC Converters.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

2019
Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

BISTs for post-bond test and electrical analysis of high density 3D interconnect defects.
Proceedings of the 23rd IEEE European Test Symposium, 2018

2016

Towards high density 3D interconnections.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015
Interconnect design study for electromigration reliability improvement.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014
Study of EM void nucleation and mechanic relaxation effects.
Microelectron. Reliab., 2014

2013
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.
Microelectron. Reliab., 2013


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