Patrick Leduc

According to our database, Patrick Leduc authored at least 9 papers between 2009 and 2013.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2013

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.

Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon

Microelectron. Reliab., 2013

Panel: "will 3D-IC remain a technology of the future... even in the future?".

Marco Casale-Rossi, Patrick Leduc, Giovanni De Micheli, Patrick Blouet, Brendan Farley, Anna Fontanelli, Dragomir Milojevic, Steve Smith

Proceedings of the Design, Automation and Test in Europe, 2013

Which interconnects for which 3D applications? Status and perspectives.

Yann Lamy, Jean-Philippe Colonna, G. Simon, Patrick Leduc, Séverine Cheramy, C. Laviron

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits.

Melanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2010

A successful implementation of dual damascene architecture to copper TSV for 3D high density applications.

Rebha El Farhane, Myriam Assous, Patrick Leduc, Aurélie Thuaire, David Bouchu, Hélène Feldis, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

System on Wafer: A New Silicon Concept in SiP.

Gilles Poupon, Nicolas Sillon, David Henry, Charlotte Gillot, Alan Mathewson, Léa Di Cioccio, Barbara Charlet, Patrick Leduc, Maud Vinet, Perrine Batude

Proc. IEEE, 2009

First integration of Cu TSV using die-to-wafer direct bonding and planarization.

Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2009

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits.

Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey

Proceedings of the IEEE International Conference on 3D System Integration, 2009