Stéphane Moreau

According to our database, Stéphane Moreau authored at least 20 papers between 2002 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects.

Jun-Ho Choy, Stéphane Moreau, Catherine Brunet-Manquat, Valeriy Sukharev, Armen Kteyan

Proceedings of the 2024 International Symposium on Physical Design, 2024

2023

Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution.

Armen Kteyan, Valeriy Sukharev, Alexander Volkov, Jun-Ho Choy, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Stéphane Moreau

Proceedings of the 2023 International Symposium on Physical Design, 2023

Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits.

Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

New Method to Perform TDDB Tests for Hybrid Bonding Interconnects.

Bassel Ayoub, Stéphane Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Hélène Frémont

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021

Effects of Boundary Conditions in Fully Convolutional Networks for Learning Spatio-Temporal Dynamics.

Antonio Alguacil, Wagner Gonçalves Pinto, Michael Bauerheim, Marc C. Jacob, Stéphane Moreau

Proceedings of the Machine Learning and Knowledge Discovery in Databases. Applied Data Science Track, 2021

3D interconnection using copper direct hybrid bonding for GaN on silicon wafer.

Christophe Dubarry, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2018

Numerical analysis of a high-order unstructured overset grid method for compressible LES of turbomachinery.

J. de Laborderie, Florent Duchaine, Laurent Gicquel, Olivier Vermorel, Gaofeng Wang, Stéphane Moreau

J. Comput. Phys., 2018

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.

Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016

ITAC: A complete 3D integration test platform.

Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Spectral recycling strategies for the solution of nonlinear eigenproblems in thermoacoustics.

Pablo Salas, Luc Giraud, Yousef Saad, Stéphane Moreau

Numer. Linear Algebra Appl., 2015

Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence.

Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaün

Microelectron. Reliab., 2015

2014

An overset grid method for large eddy simulation of turbomachinery stages.

Gaofeng Wang, Florent Duchaine, Dimitrios Papadogiannis, Ignacio Duran, Stéphane Moreau, Laurent Y. M. Gicquel

J. Comput. Phys., 2014

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO₂ direct hybrid bonding.

Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.

Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon

Microelectron. Reliab., 2013

A new experimental methodology using point deflection to quantify residual stress of thin polymer membrane materials in MEMS devices.

Sofiane Soulimane, Arnaud Pouydebasque, Sébastien Bolis, Fabrice Jacquet, Claudine Bridoux, Florian Dupont, Christophe Poulain, Stéphane Moreau, Stephane Fanget

Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

Chip to wafer copper direct bonding electrical characterization and thermal cycling.

Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

200°C direct bonding copper interconnects : Electrical results and reliability.

Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2005

MetaSurv: Web-Platform Generator for the Monitoring of Health Indicators and Interactive Geographical Information System.

Laurent Toubiana, Stéphane Moreau, Gaétan Bonnard

Proceedings of the Connecting Medical Informatics and Bio-Informatics - Proceedings of MIE 2005, 2005

2004

Comparative study of thermal cycling and thermal shocks tests on electronic components reliability.

Stéphane Moreau, Thierry Lequeu, Robert Jérisian

Microelectron. Reliab., 2004

2002

Influence of the turn-on mechanism on TRIACs' reliability: di/dt thermal fatigue study in Q1 compared to Q2.

Stéphane Moreau, Stéphane Forster, Thierry Lequeu, Robert Jérisian

Microelectron. Reliab., 2002