Olaf van der Sluis

According to our database, Olaf van der Sluis authored at least 16 papers between 2006 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Isogeometric-Mechanics-Driven Electrophysiology Simulations of Ventricular Tachycardia.

R. Willems, Evianne Kruithof, Koen L. P. M. Janssens, Matthijs J. M. Cluitmans, Olaf van der Sluis, Peter H. M. Bovendeerd, Clemens V. Verhoosel

Proceedings of the Functional Imaging and Modeling of the Heart, 2023

2011

Design and implementation of flexible and stretchable systems.

Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis, P. H. M. Timmermans

Microelectron. Reliab., 2011

2010

Prediction of the epoxy moulding compound aging effect on package reliability.

Sander Noijen, Roy Engelen, Joerg Martens, Alexandru Opran, Olaf van der Sluis, Richard B. R. van Silfhout

Microelectron. Reliab., 2010

A fast moisture sensitivity level qualification method.

Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont

Microelectron. Reliab., 2010

2009

Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics.

Olaf van der Sluis, R. A. B. Engelen, P. H. M. Timmermans, G. Q. Zhang

Microelectron. Reliab., 2009

Numerical prediction of failure paths at a roughened metal/polymer interface.

S. P. M. Noijen, Olaf van der Sluis, P. H. M. Timmermans, G. Q. Zhang

Microelectron. Reliab., 2009

2008

The need for multi-scale approaches in Cu/low-k reliability issues.

Cadmus A. Yuan, Olaf van der Sluis, Willem D. van Driel, G. Q. (Kouchi) Zhang

Microelectron. Reliab., 2008

Characterization of semiconductor interfaces using a modified mixed mode bending apparatus.

J. Thijsse, Olaf van der Sluis, J. A. W. van Dommelen, Willem D. van Driel, Marc G. D. Geers

Microelectron. Reliab., 2008

2007

Molecular simulation on the material/interfacial strength of the low-dielectric materials.

Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout

Microelectron. Reliab., 2007

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion.

Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, Marcel A. J. van Gils

Microelectron. Reliab., 2007

Characterization of moisture properties of polymers for IC packaging.

Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang

Microelectron. Reliab., 2007

Cohesive zone modeling for structural integrity analysis of IC interconnects.

B. A. E. van Hal, Ron H. J. Peerlings, Marc G. D. Geers, Olaf van der Sluis

Microelectron. Reliab., 2007

Analysis of Cu/low-k bond pad delamination by using a novel failure index.

Marcel A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken

Microelectron. Reliab., 2007

2006

Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.

Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang

Microelectron. Reliab., 2006

Multiscale modelling of multilayer substrates.

R. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang

Microelectron. Reliab., 2006

Reliability modelling for packages in flexible end-products.

W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang

Microelectron. Reliab., 2006