Deniz Sabuncuoglu Tezcan

According to our database, Deniz Sabuncuoglu Tezcan authored at least 4 papers between 2009 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Wafer Level Pixelation of Colloidal Quantum Dot Image Sensors.

Yunlong Li, Gauri Karve, Pawel E. Malinowski, Joo Hyoung Kim, Epimitheas Georgitzikis, Vladimir Pejovic, Myung-Jin Lim, Luis Moreno Hagelsieb, Renaud Puybaret, Itai Lieberman, Jiwon Lee, David Cheyns, Paul Heremans, Haris Osman, Deniz Sabuncuoglu Tezcan

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2019

A 300mm CMOS-Compatible PECVD Silicon Nitride Platform for Integrated Photonics with Low Loss and Low Process Induced Phase Variation.

Sandeep S. Saseendran, Tangla D. Kongnyuy, Bruno Figeys, Federico Buja, Benedetto Troia, Sarp Kerman, Aleksandrs Marinins, Roelof Jansen, Xavier Rottenberg, Deniz Sabuncuoglu Tezcan, Philippe Soussan

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2019

2010

A novel concept for ultra-low capacitance via-last TSV.

Yann Civale, Marcel Gonzalez, Deniz Sabuncuoglu Tezcan, Youssef Travaly, Philippe Soussan, Eric Beyne

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping.

Yann Civale, Deniz Sabuncuoglu Tezcan, Harold G. G. Philipsen, P. Jaenen, Rahul Agarwal, F. Duval, Philippe Soussan, Youssef Travaly, Eric Beyne

Proceedings of the IEEE International Conference on 3D System Integration, 2009