Marcel Gonzalez

According to our database, Marcel Gonzalez authored at least 5 papers between 2004 and 2016.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2016

B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages.

Aidan Cowley, Andrej Ivankovic, C. S. Wong, N. S. Bennett, A. N. Danilewsky, Marcel Gonzalez, Vladimir Cherman, Bart Vandevelde, Ingrid De Wolf, P. J. McNally

Microelectron. Reliab., 2016

2014

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.

Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei

Microelectron. Reliab., 2014

2011

Analysis of microbump induced stress effects in 3D stacked IC technologies.

Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, W. Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

A novel concept for ultra-low capacitance via-last TSV.

Yann Civale, Marcel Gonzalez, Deniz Sabuncuoglu Tezcan, Youssef Travaly, Philippe Soussan, Eric Beyne

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2004

Characterization and FE analysis on the shear test of electronic materials.

Marcel Gonzalez, Bart Vandevelde, R. Van Hoof, Eric Beyne

Microelectron. Reliab., 2004