Eric Woirgard

According to our database, Eric Woirgard authored at least 35 papers between 2001 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses.

Omar Chihani, L. Théolier, Alain Bensoussan, Jean-Yves Delétage, André Durier, Eric Woirgard

Microelectron. Reliab., 2018

Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs.

Omar Chihani, Loic Théolier, Jean-Yves Delétage, Eric Woirgard, Alain Bensoussan, André Durier

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017

Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering.

Maxime Barrière, Alexandrine Guédon-Gracia, Eric Woirgard, Serge Bontemps, François Le Henaff

Microelectron. Reliab., 2017

2016

Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices.

Faical Arabi, Loic Théolier, Donatien Martineau, Jean-Yves Delétage, M. Medina, Eric Woirgard

Microelectron. Reliab., 2016

2015

Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity.

Toni Youssef, W. Rmili, Eric Woirgard, Stephane Azzopardi, N. Vivet, D. M. Meekhof, Régis Meuret, G. Le Quilliec, C. Richard

Microelectron. Reliab., 2015

Identification and analysis of power substrates degradations subjected to severe aging tests.

Eric Woirgard, Faical Arabi, Wissam Sabbah, Donatien Martineau, L. Théolier, Stephane Azzopardi

Microelectron. Reliab., 2015

Ageing mechanisms in Deep Trench Termination (DT²) Diode.

F. Baccar, Houssam Arbess, L. Théolier, Stephane Azzopardi, Eric Woirgard

Microelectron. Reliab., 2015

Mechanical stress investigation after technological process in Deep Trench Termination DT² using BenzoCycloButene as dielectric material.

Houssam Arbess, F. Baccar, L. Théolier, Stephane Azzopardi, Eric Woirgard

Microelectron. Reliab., 2015

2013

Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy.

Wissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard

Microelectron. Reliab., 2013

Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach.

F. Baccar, Stephane Azzopardi, L. Théolier, K. El Boubkari, Jean-Yves Delétage, Eric Woirgard

Microelectron. Reliab., 2013

2012

A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization.

François Le Henaff, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet

Microelectron. Reliab., 2012

Remaining useful life prediction of lithium batteries in calendar ageing for automotive applications.

Akram Eddahech, Olivier Briat, Eric Woirgard, Jean-Michel Vinassa

Microelectron. Reliab., 2012

2011

Ageing monitoring of lithium-ion cell during power cycling tests.

Akram Eddahech, Olivier Briat, Hervé Henry, Jean-Yves Delétage, Eric Woirgard, Jean-Michel Vinassa

Microelectron. Reliab., 2011

How supercapacitors reach end of life criteria during calendar life and power cycling tests.

Ramzi Chaari, Olivier Briat, Jean-Yves Delétage, Eric Woirgard, Jean-Michel Vinassa

Microelectron. Reliab., 2011

2010

Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling.

Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, H. El Brouji, Jean-Yves Delétage, Eric Woirgard

Microelectron. Reliab., 2010

Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature.

Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard

Microelectron. Reliab., 2010

2009

Impact of Calendar Life and Cycling Ageing on Supercapacitor Performance.

E.-Hassane El Brouji, Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, Eric Woirgard

IEEE Trans. Veh. Technol., 2009

An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications.

Alexandre Micol, A. Zeanh, T. Lhommeau, Stephane Azzopardi, Eric Woirgard, Olivier Dalverny, Moussa Karama

Microelectron. Reliab., 2009

Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions.

H. El Brouji, Olivier Briat, Jean-Michel Vinassa, Hervé Henry, Eric Woirgard

Microelectron. Reliab., 2009

Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation.

Yassine Belmehdi, Stephane Azzopardi, A. Benmansour, Jean-Yves Delétage, Eric Woirgard

Microelectron. Reliab., 2009

2008

Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests.

H. El Brouji, Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, Eric Woirgard

Microelectron. Reliab., 2008

2007

Monitoring fading rate of ultracapacitors using online characterization during power cycling.

Walid Lajnef, Jean-Michel Vinassa, Olivier Briat, H. El Brouji, Eric Woirgard

Microelectron. Reliab., 2007

A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation.

Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard

Microelectron. Reliab., 2007

Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions.

Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard

Microelectron. Reliab., 2007

2006

Power cycling tests for accelerated ageing of ultracapacitors.

Olivier Briat, Walid Lajnef, Jean-Michel Vinassa, Eric Woirgard

Microelectron. Reliab., 2006

Failure mechanism of trench IGBT under short-circuit after turn-off.

Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard

Microelectron. Reliab., 2006

2005

Specification and use of pulsed current profiles for ultracapacitors power cycling.

Walid Lajnef, Jean-Michel Vinassa, Olivier Briat, Eric Woirgard

Microelectron. Reliab., 2005

Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability.

Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini

Microelectron. Reliab., 2005

Assessment of the Trench IGBT reliability: low temperature experimental characterization.

Stephane Azzopardi, A. Benmansour, M. Ishiko, Eric Woirgard

Microelectron. Reliab., 2005

2004

Influence of the thermo-mechanical residual state on the power assembly modellization.

Alexandrine Guédon-Gracia, Pascal Roux, Eric Woirgard, Christian Zardini

Microelectron. Reliab., 2004

2003

Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant.

Alexandrine Guédon, Eric Woirgard, Christian Zardini, Guillaume Simon

Microelectron. Reliab., 2003

IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power?

Stephane Azzopardi, Eric Woirgard, Jean-Michel Vinassa, Olivier Briat, Christian Zardini

Microelectron. Reliab., 2003

2002

Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations.

P. Guilbault, Eric Woirgard, Christian Zardini, D. Lambert

Microelectron. Reliab., 2002

Evaluation of lead-free soldering for automotive applications.

Alexandrine Guédon, Eric Woirgard, Christian Zardini

Microelectron. Reliab., 2002

2001

Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs.

Stephane Azzopardi, Atsuo Kawamura, Hideo Iwamoto, Olivier Briat, Jean-Michel Vinassa, Eric Woirgard, Christian Zardini

Microelectron. Reliab., 2001