Alexandrine Guédon-Gracia

According to our database, Alexandrine Guédon-Gracia authored at least 15 papers between 2002 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Creep measurement and choice of creep laws for BGA assemblies' reliability simulation.

S. Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont

Microelectron. Reliab., 2018

Sequential combined thermal cycling and vibration test and simulation of printed circuit board.

Faical Arabi, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont

Microelectron. Reliab., 2018

2017

High temperature ageing of microelectronics assemblies with SAC solder joints.

Wissam Sabbah, Pierre Bondue, Oriol Avino-Salvado, Cyril Buttay, Hélène Frémont, Alexandrine Guédon-Gracia, Hervé Morel

Microelectron. Reliab., 2017

Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations.

S. Pin, Hélène Frémont, Alexandrine Guédon-Gracia

Microelectron. Reliab., 2017

Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering.

Maxime Barrière, Alexandrine Guédon-Gracia, Eric Woirgard, Serge Bontemps, François Le Henaff

Microelectron. Reliab., 2017

2016

Effects of salt spray test on lead-free solder alloy.

Alexandrine Guédon-Gracia, Hélène Frémont, Bernard Plano, Jean-Yves Delétage, Kirsten Weide-Zaage

Microelectron. Reliab., 2016

2015

Virtual prototyping in a Design-for-Reliability approach.

Samed Barnat, Alexandrine Guédon-Gracia, Hélène Frémont

Microelectron. Reliab., 2015

2012

A methodological approach for predictive reliability: Practical case studies.

Hélène Frémont, Geneviève Duchamp, Alexandrine Guédon-Gracia, Frédéric Verdier

Microelectron. Reliab., 2012

Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength.

Samed Barnat, Hélène Frémont, Alexandrine Guédon-Gracia, Eric Cadalen

Microelectron. Reliab., 2012

2009

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage.

Maxime Berthou, P. Retailleau, Hélène Frémont, Alexandrine Guédon-Gracia, C. Jéphos-Davennel

Microelectron. Reliab., 2009

2005

Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability.

Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini

Microelectron. Reliab., 2005

2004

First step in the reliability assessment of ultracapacitors used as power source in hybrid electric vehicles.

Walid Lajnef, Jean-Michel Vinassa, Stephane Azzopardi, Olivier Briat, Alexandrine Guédon-Gracia, Christian Zardini

Microelectron. Reliab., 2004

Influence of the thermo-mechanical residual state on the power assembly modellization.

Alexandrine Guédon-Gracia, Pascal Roux, Eric Woirgard, Christian Zardini

Microelectron. Reliab., 2004

2003

Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant.

Alexandrine Guédon, Eric Woirgard, Christian Zardini, Guillaume Simon

Microelectron. Reliab., 2003

2002

Evaluation of lead-free soldering for automotive applications.

Alexandrine Guédon, Eric Woirgard, Christian Zardini

Microelectron. Reliab., 2002