Wissam Sabbah

According to our database, Wissam Sabbah authored at least 4 papers between 2013 and 2017.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2017

High temperature ageing of microelectronics assemblies with SAC solder joints.

Wissam Sabbah, Pierre Bondue, Oriol Avino-Salvado, Cyril Buttay, Hélène Frémont, Alexandrine Guédon-Gracia, Hervé Morel

Microelectron. Reliab., 2017

Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling.

Wissam Sabbah, Faical Arabi, Oriol Avino-Salvado, Cyril Buttay, L. Théolier, Hervé Morel

Microelectron. Reliab., 2017

2015

Identification and analysis of power substrates degradations subjected to severe aging tests.

Eric Woirgard, Faical Arabi, Wissam Sabbah, Donatien Martineau, L. Théolier, Stephane Azzopardi

Microelectron. Reliab., 2015

2013

Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy.

Wissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard

Microelectron. Reliab., 2013