Stephane Azzopardi

According to our database, Stephane Azzopardi authored at least 20 papers between 2001 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2019

A Study on Shunt Resistor-based Current Measurements for Fast Switching GaN Devices.

Thilini Wickramasinghe, Stephane Azzopardi, Bruno Allard, Cyril Buttay, Charles Joubert, Christian Martin, Jean-François Mogniotte, Hervé Morel, Pascal Bevilacqua, Thanh-Long Le

Proceedings of the IECON 2019, 2019

Overview and new trends in technology bricks for reliability enhancement in future wide band gap power converters for More Electrical Aircraft (MEA) and More Electrical Propulsion (MEP) systems.

Bertrand Revol, Stephane Azzopardi, Toni Youssef, Jean Sylvio Ngoua Teu, Cyrille Gautier, Rabih Khazaka, Sara Roggia

Proceedings of the IECON 2019, 2019

2018

Effect of short circuit aging on safe operating area of SiC MOSFET.

Tien Anh Nguyen, Stéphane Lefebvre, Stephane Azzopardi

Microelectron. Reliab., 2018

2015

Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity.

Toni Youssef, W. Rmili, Eric Woirgard, Stephane Azzopardi, N. Vivet, D. M. Meekhof, Régis Meuret, G. Le Quilliec, C. Richard

Microelectron. Reliab., 2015

Identification and analysis of power substrates degradations subjected to severe aging tests.

Eric Woirgard, Faical Arabi, Wissam Sabbah, Donatien Martineau, L. Théolier, Stephane Azzopardi

Microelectron. Reliab., 2015

Ageing mechanisms in Deep Trench Termination (DT²) Diode.

F. Baccar, Houssam Arbess, L. Théolier, Stephane Azzopardi, Eric Woirgard

Microelectron. Reliab., 2015

Mechanical stress investigation after technological process in Deep Trench Termination DT² using BenzoCycloButene as dielectric material.

Houssam Arbess, F. Baccar, L. Théolier, Stephane Azzopardi, Eric Woirgard

Microelectron. Reliab., 2015

2013

Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy.

Wissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard

Microelectron. Reliab., 2013

Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach.

F. Baccar, Stephane Azzopardi, L. Théolier, K. El Boubkari, Jean-Yves Delétage, Eric Woirgard

Microelectron. Reliab., 2013

2012

A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization.

François Le Henaff, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet

Microelectron. Reliab., 2012

2010

Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature.

Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard

Microelectron. Reliab., 2010

2009

An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications.

Alexandre Micol, A. Zeanh, T. Lhommeau, Stephane Azzopardi, Eric Woirgard, Olivier Dalverny, Moussa Karama

Microelectron. Reliab., 2009

Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation.

Yassine Belmehdi, Stephane Azzopardi, A. Benmansour, Jean-Yves Delétage, Eric Woirgard

Microelectron. Reliab., 2009

2007

A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation.

Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard

Microelectron. Reliab., 2007

Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions.

Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard

Microelectron. Reliab., 2007

2006

Failure mechanism of trench IGBT under short-circuit after turn-off.

Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard

Microelectron. Reliab., 2006

2005

Assessment of the Trench IGBT reliability: low temperature experimental characterization.

Stephane Azzopardi, A. Benmansour, M. Ishiko, Eric Woirgard

Microelectron. Reliab., 2005

2004

First step in the reliability assessment of ultracapacitors used as power source in hybrid electric vehicles.

Walid Lajnef, Jean-Michel Vinassa, Stephane Azzopardi, Olivier Briat, Alexandrine Guédon-Gracia, Christian Zardini

Microelectron. Reliab., 2004

2003

IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power?

Stephane Azzopardi, Eric Woirgard, Jean-Michel Vinassa, Olivier Briat, Christian Zardini

Microelectron. Reliab., 2003

2001

Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs.

Stephane Azzopardi, Atsuo Kawamura, Hideo Iwamoto, Olivier Briat, Jean-Michel Vinassa, Eric Woirgard, Christian Zardini

Microelectron. Reliab., 2001