Jean-Yves Delétage

Orcid: 0000-0002-8335-0967

According to our database1, Jean-Yves Delétage authored at least 23 papers between 2003 and 2018.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Bibliography

2018
Efficient state of health estimation of Li-ion battery under several ageing types for aeronautic applications.
Microelectron. Reliab., 2018

Creep measurement and choice of creep laws for BGA assemblies' reliability simulation.
Microelectron. Reliab., 2018

Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses.
Microelectron. Reliab., 2018

Sequential combined thermal cycling and vibration test and simulation of printed circuit board.
Microelectron. Reliab., 2018

Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Characterization of external pressure effects on lithium-ion pouch cell.
Proceedings of the IEEE International Conference on Industrial Technology, 2018

2017
Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach.
Microelectron. Reliab., 2017

Performance quantification of latest generation Li-ion batteries in wide temperature range.
Proceedings of the IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society, Beijing, China, October 29, 2017

2016
Effects of salt spray test on lead-free solder alloy.
Microelectron. Reliab., 2016

Chemical rate phenomenon approach applied to lithium battery capacity fade estimation.
Microelectron. Reliab., 2016

Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices.
Microelectron. Reliab., 2016

2013
Conductive adhesive joint for extreme temperature applications.
Microelectron. Reliab., 2013

Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach.
Microelectron. Reliab., 2013

2012
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization.
Microelectron. Reliab., 2012

2011
Ageing monitoring of lithium-ion cell during power cycling tests.
Microelectron. Reliab., 2011

How supercapacitors reach end of life criteria during calendar life and power cycling tests.
Microelectron. Reliab., 2011

2010
Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling.
Microelectron. Reliab., 2010

Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature.
Microelectron. Reliab., 2010

2009
Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation.
Microelectron. Reliab., 2009

2004
How to study delamination in plastic encapsulated devices.
Microelectron. Reliab., 2004

2003
Moisture diffusion in BCB resins used for MEMS packaging.
Microelectron. Reliab., 2003

Three-dimensional FEM simulations of thermomechanical stresses in 1.55 mum Laser modules.
Microelectron. Reliab., 2003

Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations.
Microelectron. Reliab., 2003


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