Faical Arabi

According to our database, Faical Arabi authored at least 4 papers between 2015 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2018

Sequential combined thermal cycling and vibration test and simulation of printed circuit board.

Faical Arabi, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont

Microelectron. Reliab., 2018

2017

Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling.

Wissam Sabbah, Faical Arabi, Oriol Avino-Salvado, Cyril Buttay, L. Théolier, Hervé Morel

Microelectron. Reliab., 2017

2016

Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices.

Faical Arabi, Loic Théolier, Donatien Martineau, Jean-Yves Delétage, M. Medina, Eric Woirgard

Microelectron. Reliab., 2016

2015

Identification and analysis of power substrates degradations subjected to severe aging tests.

Eric Woirgard, Faical Arabi, Wissam Sabbah, Donatien Martineau, L. Théolier, Stephane Azzopardi

Microelectron. Reliab., 2015