Geneviève Duchamp

According to our database1, Geneviève Duchamp authored at least 15 papers between 2002 and 2025.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of four.

Timeline

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Bibliography

2025
Investigation Into the Moisture Degradation Mechanism of Integrated Stacks Using New Moisture Sensor Design.
Proceedings of the IEEE International Reliability Physics Symposium, 2025

2024
Susceptibility of an Analog Temperature Measurement Function: First Step to Optimize the IEMI Waveform.
Proceedings of the 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2024

2018
Effects of HPEM stress on GaAs low-noise amplifier from circuit to component scale.
Microelectron. Reliab., 2018

2017
Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach.
Microelectron. Reliab., 2017

2015
A New Method for the Characterization of Electronic Components Immunity.
IEEE Trans. Instrum. Meas., 2015

Characterization and model of temperature effect on the conducted immunity of Op-Amp.
Microelectron. Reliab., 2015

Failure mechanism study and immunity modeling of an embedded analog-to-digital converter based on immunity measurements.
Microelectron. Reliab., 2015

2014
Qualification procedure for moisture in embedded capacitors.
Microelectron. Reliab., 2014

2013
Conducted immunity of three Op-Amps using the DPI measurement technique and VHDL-AMS modeling.
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

2012
A methodological approach for predictive reliability: Practical case studies.
Microelectron. Reliab., 2012

2011
Control of the electromagnetic compatibility: An issue for IC reliability.
Microelectron. Reliab., 2011

2009
Electromagnetic immunity model of an ADC for microcontroller's reliability improvement.
Microelectron. Reliab., 2009

2007
Near-field EMC study to improve electronic component reliability.
Microelectron. Reliab., 2007

2004
Reliability of Low-Cost PCB Interconnections for Telecommunication Applications.
Microelectron. Reliab., 2004

2002
Evaluation of a micropackaging analysis technique by highfrequency microwaves.
Microelectron. Reliab., 2002


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